Blade Assembly with Hermetic LED Cavity for Fan Displays

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing fan displays using surface mounted devices (SMDs) face issues such as high wind resistance, low display resolution, poor moisture-proof and waterproof performance, and susceptibility to damage due to the large size and exposed pins of SMDs, which limits their outdoor use and maintenance convenience.

Innovation Solution

A blade assembly with an elongated circuit substrate and lamination board bonded by laminating glue, featuring a mounting cavity for hermetically disposing LED light emitting units, reducing protrusion and wind resistance, and providing a denser, sealed arrangement for improved resolution and durability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If SMDs are used to mount LED lamps on the blade surface, then the LED lamps can be easily mounted, but the blade is subject to relatively large wind resistance and generates big noise during rotation

Engineering Contradiction:
Improveease of mounting LED lampsVSAvoidwind resistance and noise
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The LED lamp is nested inside a cavity formed by the circuit substrate and lamination board, with the light emitting surface flush with the blade surface. This nesting structure eliminates protrusion, reducing wind resistance and noise during rotation while maintaining easy manufacturability through standardized cavity formation processes.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Ease of manufacture

If SMDs are used with relatively large size, then the mounting process is simplified, but the density of SMDs on the blade is low, resulting in low overall display resolution

Engineering Contradiction:
Improvesimplicity of mounting processVSAvoiddisplay resolution
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention transitions from surface-mounted two-dimensional arrangement to three-dimensional cavity-integrated mounting. The LED lamp is positioned within the cavity depth dimension, allowing the light emitting surface to be flush with the blade surface while enabling higher density arrangement through optimized cavity geometry and LED placement, thereby improving display resolution without complicating the mounting process.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Device complexity

If SMDs are used with exposed pins, then the mounting structure is simple, but the moisture-proof and waterproof performance is poor, making it unsuitable for outdoor use

Engineering Contradiction:
Improvesimplicity of mounting structureVSAvoidmoisture-proof and waterproof performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The LED lamp is nested within the cavity formed by the circuit substrate and lamination board, with the cavity serving as a protective enclosure. This nesting structure completely covers the LED lamp and its electrical connections, preventing moisture and dust ingress while maintaining a simple overall mounting structure that integrates seamlessly with the blade assembly.

Inventive Principle:
Principle #7Nested doll (Nesting)

4Ease of manufacture

If SMDs are used with exposed surfaces and pins, then the assembly process is straightforward, but the SMDs are susceptible to bump and damage during assembly

Engineering Contradiction:
Improvestraightforwardness of assemblyVSAvoidresistance to bump and damage
Core Design Contradiction:
Ease of manufactureVSStrength

Solution Approach 1:

The LED lamp is nested within the protective cavity formed by the circuit substrate and lamination board. This cavity structure shields the LED lamp and its vulnerable pins from external impacts and bumps during assembly and operation, while the overall structure remains straightforward to manufacture using standard PCB and lamination board fabrication processes.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces noise and wind resistance, enhances waterproof and dustproof performance, and increases display resolution by eliminating exposed pins and using a non-SMD design, making the fan display more suitable for outdoor use and easier to maintain.

Implementation Method 1

Both the circuit substrate and the lamination board are bonded to each other by a laminating glue

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

The plurality of LED light emitting units are hermetically disposed in the mounting cavity

Methodology Applied
Scientific EffectLight emitting diode effect: Light Emitting Diode

Implementation Method 3

light emitting diode (LED) light emitting units

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS11448392B2Blade assembly and fan display having the same
Publication Date: 2022.09.20 FOSHAN NATIONSTAR OPTOELECTRONICS CO LTD
  • US11448392B2 patent drawing
  • US11448392B2 patent drawing
  • US11448392B2 patent drawing

AI summary

A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.