Bladeless Wafer Separation Apparatus
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Solution Overview
Problem
Existing methods for separating a support plate from a thinned semiconductor wafer are prone to breaking the wafer due to the need for precise blade insertion, requiring high location accuracy and manual handling, which is cumbersome and risky.
Innovation Solution
A separating apparatus that grips the outer peripheral end of the support plate using a clamp and sucking plate, dissolves the adhesive, and separates the support plate from the wafer using suction and gas supply to minimize stress on the wafer, allowing for secure and automatic separation without direct contact that could break the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a blade is inserted between the wafer and support plate to separate them, then the support plate can be separated from the wafer, but the wafer is highly likely to be broken due to the thinning process
Solution Approach 1:
A bladeless separator is introduced as an intermediary tool that separates the wafer from the support plate without direct blade contact. The separator inserts into the adhesive material and uses vibration and biasing forces to break the adhesive bond, eliminating the risk of wafer breakage associated with traditional blade insertion methods
Solution Approach 2:
The traditional mechanical blade insertion method is replaced with a vibration-based separation mechanism. The bladeless separator vibrates the adhesive material while biasing the wafer away from the support plate, substituting direct mechanical cutting with oscillatory adhesive breakdown
2Ease of manufacture
If a blade is inserted between the wafer and support plate, then separation can be achieved, but an extremely high level of location accuracy is required for secure insertion
Solution Approach 1:
The bladeless separator acts as an intermediary that eliminates the need for precise location accuracy. By inserting into the adhesive material rather than between the wafer and support plate, and using vibration to propagate separation, the system removes the critical positioning requirement of traditional blade methods
3Productivity
If manual handling is used for thinned wafers, then the wafer can be conveyed, but it is troublesome and time-consuming
Solution Approach 1:
The wafer support system enables automatic conveyance of thinned wafers by maintaining wafer strength through support plate attachment. The system serves itself by preventing wafer breakage through structural support, eliminating the need for careful manual handling and enabling automated processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables safe and automated separation of the support plate from the wafer, preventing damage to the wafer and facilitating the handling of miniaturized semiconductor devices by reducing the risk of cracking or warpage during the separation process.
Implementation Method 1
A separating apparatus that grips the outer peripheral end of the support plate using a clamp and sucking plate
Implementation Method 2
separates the support plate from the wafer using suction and gas supply to minimize stress on the wafer
Implementation Method 3
dissolves the adhesive, and separates the support plate from the wafer
Data Source
AI summary
A separating apparatus according to the present invention includes a clamp for gripping an outer peripheral end of a supporting plate. The clamp grips the outer peripheral end of the supporting plate and separates the supporting plate from a wafer by gripping the supporting plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer. With this, a supporting plate can be separated from a wafer to which the supporting plate has been attached, without breaking the wafer.