Blanking Aperture Array Bump Connections for Multi-Beam Impedance
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Solution Overview
Problem
Conventional multi-beam writing apparatuses face challenges with impedance mismatch and limited installation density due to wire bonding, which hinder high-speed data transmission and increase the number of control circuits required, thereby reducing data transmission rates.
Innovation Solution
A blanking system with a blanking aperture array device featuring a first substrate with penetrating openings and electrode groups, a second substrate connected through bumps, and an optional FPGA for signal conversion, allowing for reduced impedance mismatch and increased installation density through bump connections and differential signaling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for signal connection between blanking aperture array and mounting substrate, then electrical connection is established, but impedance mismatch occurs and installation density is limited
Solution Approach 1:
The patent replaces the mechanical wire bonding system with an automated pick-and-place system using bump connections. This substitution eliminates the impedance mismatch issues inherent in wire bonding while enabling higher installation density through precise automated placement of conductive bumps on the substrate.
Solution Approach 2:
The patent changes the connection parameter from wire bonding to bump connection with specific dimensional constraints (bump diameter 0.05-0.15mm, spacing 0.2-0.5mm). These parameter changes optimize both electrical performance by reducing impedance mismatch and spatial efficiency by increasing installation density.
2Reliability
If wire bonding is used for signal connection, then electrical connection is established, but data transmission rate is reduced due to increased number of control circuits
Solution Approach 1:
The patent replaces wire bonding with bump connections that enable more efficient signal routing and reduce the number of required control circuits. The automated pick-and-place process creates optimized signal paths that improve data transmission rate while maintaining connection stability.
Solution Approach 2:
The patent transitions from two-dimensional wire routing to three-dimensional bump placement, allowing signals to be established vertically through the substrate thickness. This dimensional change reduces signal path length and enables higher data transmission rates with fewer control circuits.
3Reliability
If wire bonding is used, then signal transmission is achieved, but heat generation increases and installation density decreases
Solution Approach 1:
The patent replaces wire bonding with bump connections that have lower electrical resistance and better thermal conductivity. This substitution reduces heat generation at the connection points while maintaining reliable signal transmission, and the compact bump structure enables higher installation density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-speed data transmission and increased installation density, reducing heat generation and eliminating the need for complex wire bonding, while maintaining effective blanking control of multi-charged particle beams.
Implementation Method 1
a second substrate whose lower surface is electrically connected through a bump to an upper surface of the first substrate, and a mounting substrate whose upper surface is electrically connected through a bump to a lower surface of the second substrate
Data Source
AI summary
A blanking system for multi charged particle beams includes a blanking aperture array device to include a first substrate where a plurality of openings corresponding to passage positions of multi-beams are formed in a penetrating manner from the upper surface, and a plurality of electrode groups each having a pair of electrodes which are close to a corresponding one of the plurality of openings and are at opposite sides, on a same surface, of the corresponding one of the plurality of openings are arranged on the first substrate, a second substrate whose lower surface is electrically connected through a bump to the upper surface of the first substrate, and a mounting substrate whose upper surface is electrically connected through a bump to the lower surface of the second substrate.