Blanking Aperture Array Shielding for Stable Beam Control

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Solution Overview

Problem

In electron beam lithography, scattered electrons can charge the substrate of the blanking aperture array, leading to malfunction and noise in the control signal, destabilizing the blanking control process.

Innovation Solution

A conductive covering member is provided to cover the bonding wires while maintaining electrical insulation, preventing scattered electrons from reaching the substrate and pads, and a shielding member is used to further ground the system, reducing the risk of charging and noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If scattered electrons are allowed to reach the substrate, then the substrate becomes charged, but this causes malfunction in blanking control and noise in control signals

Engineering Contradiction:
Improveblanking control stabilityVSAvoidsubstrate charging and noise
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A conductive covering member is introduced as an intermediary between the scattered electrons and the substrate/bonding wires. This covering member intercepts the scattered electrons before they can reach the substrate or bonding wires, preventing charge accumulation and noise generation while allowing the system to maintain its normal blanking control function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The harmful scattered electrons are extracted or removed from the system by the conductive covering member. The covering member collects and redirects the scattered electrons away from the substrate and bonding wires, effectively eliminating the harmful factors without affecting the primary electron beam function

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If the conductive covering member is positioned to fully protect the bonding wires, then noise is reduced, but the structure becomes more complex

Engineering Contradiction:
Improvecontrol signal qualityVSAvoidcovering member structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive covering member is positioned to provide localized protection only where needed - specifically covering the bonding wires and critical substrate areas that are most susceptible to scattered electron damage. The covering member does not extend unnecessarily, maintaining a balance between protection and structural simplicity by applying coverage selectively to vulnerable regions

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively suppresses charging of the substrate and noise in the control signal, stabilizing the blanking control and preventing operational failures.

Implementation Method 1

a conductive covering member covering the bonding wires while maintaining electrical insulation from the bonding wires

Methodology Applied
Scientific EffectElectrical insulation: Electrical Resistance

Implementation Method 2

a shielding member used to further ground the system, reducing the risk of charging and noise

Methodology Applied
Scientific EffectGrounding: Earthing

Data Source

PatentUS11837429B2Blanking aperture array unit
Publication Date: 2023.12.05 NUFLARE TECH INC
  • US11837429B2 patent drawing
  • US11837429B2 patent drawing
  • US11837429B2 patent drawing

AI summary

A blanking aperture array unit according to the present embodiment includes a chip configured to control a charged particle beam by blanking control of switching whether to irradiate a target with the charged particle beam; a substrate having the chip mounted thereon; a wire configured to electrically connect pads on the chip to the substrate and transmit a control signal for the blanking control from the substrate to the chip through the pads; and a conductive covering member having a first end connected to the substrate and a second end located on the chip, the covering member being provided from the first end to the second end to cover the wire while maintaining electrical insulation from the wire, and at least two end sides of the second end of the covering member are nearer a central portion of the chip than locations of the pads on the chip.