Bleeder Resistor Circuit Layout With Equipotential Metal Covers

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Solution Overview

Problem

Conventional semiconductor devices with bleeder resistance circuits face issues of resistance value variations due to hydrogen entry and potential differences between resistors and metal films, and their configurations are complex.

Innovation Solution

A semiconductor device design with a series-connected configuration of fixed and variable resistance elements, covered by individual first and second metal films, ensures equipotential connections to reduce resistance variations and prevent hydrogen entry, simplifying the device structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal films are used to cover fixed resistance elements to prevent hydrogen entry, then resistance value variations due to hydrogen are reduced, but potential difference between resistors and metal films causes resistance variations

Engineering Contradiction:

Improveresistance value stabilityVSAvoidresistance value variation

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies equipotentiality by electrically connecting the metal films covering the fixed resistance elements to the same potential as the resistance elements themselves. This is achieved by forming metal films at the same potential level as the fixed resistance elements, eliminating the potential difference that causes resistance variations. The metal films are connected to the same power supply potential, ensuring no voltage gradient exists between the resistor and its covering film.

Inventive Principle:

Principle #12Equipotentiality

2Manufacturing precision

If multiple metal wirings are individually divided and connected to fixed resistance elements to eliminate potential difference, then resistance variations are reduced, but device configuration becomes complex

Engineering Contradiction:

Improveresistance value uniformityVSAvoiddevice structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple individual metal wiring connections into a single continuous metal film structure. Instead of providing separate metal wirings for each fixed resistance element, the invention uses a continuous metal film that covers multiple resistance elements while maintaining them at the same potential. This simplifies the device structure by eliminating the need for multiple discrete wiring connections while still achieving equipotential conditions.

Inventive Principle:

Principle #5Merging (Combining)

3Manufacturing precision

If a second metal wiring is added to cover first metal wirings to eliminate potential difference, then resistance variations are reduced, but manufacturing process becomes complicated

Engineering Contradiction:

Improveresistance value consistencyVSAvoidmanufacturing process simplicity

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent extracts and eliminates the unnecessary second metal wiring layer from the structure. By recognizing that the first metal film already provides sufficient coverage and equipotential connection, the invention removes the redundant second metal wiring that was previously added to cover the first metal wirings. This simplifies the manufacturing process by reducing the number of fabrication steps while maintaining resistance value consistency.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively reduces resistance value variations and simplifies the device configuration by maintaining equipotential connections and preventing hydrogen entry, thereby enhancing accuracy and manufacturing efficiency.

Implementation Method 1

the first cover portion includes two or more first metal films electrically connected, correspondingly, to units having any number of the fixed resistance elements, and the second cover portion includes a second metal film electrically connected to the plurality of variable resistance elements

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

During the manufacturing process of a bleeder resistance circuit, hydrogen may enter and cause variations in the resistance value of each resistor. To reduce the effect of hydrogen, the resistor is covered with a metal film or the like

Methodology Applied

Scientific EffectPhysical barrier / Diffusion prevention: Diffusion Barrier

Data Source

PatentUS12444701B2Semiconductor device with fixed resistance and variable resistance elements

Publication Date: 2025.10.14 ABLIC INC

AI summary

Provided is a semiconductor device. The semiconductor device includes a first circuit that includes a plurality of fixed resistance elements connected in series; a second circuit that includes a plurality of variable resistance elements connected in series and that is connected in series to the first circuit; a first cover portion that is provided on an upper layer side of the first circuit and that covers the first circuit; and a second cover portion that is provided on an upper layer side of the second circuit and that covers the second circuit. The first cover portion included two or more first metal films electrically connected, correspondingly, to units having any number of the fixed resistance elements, and the second cover portion includes a second metal film electrically connected to the plurality of the variable resistance elements.