Blind-Cavity Substrate Assembly for Stable Embedded Components

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Solution Overview

Problem

In IC packages, embedding passive components in blind cavities can lead to mechanical instability and alignment issues due to inconsistent cavity heights and uneven bases, affecting the stability and proper mounting of dies.

Innovation Solution

The use of a polymer layer or metal layer to support the passive components within the substrate cavity, ensuring precise positioning and improved mechanical stability by embedding the components at the correct height and aligning them accurately.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If passive components are embedded in blind cavities of substrate, then device integration is improved and surface area is reduced, but mechanical stability deteriorates and alignment precision worsens due to inconsistent cavity heights and uneven bases

Engineering Contradiction:

Improvepackage surface areaVSAvoidcomponent alignment precision

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

A leveler layer is deposited at the bottom of the blind cavity before embedding the passive component. This preliminary action creates a flat, uniform base surface that compensates for variations in cavity height, ensuring precise alignment and stable positioning of the component regardless of the underlying substrate variations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The leveler layer acts as an intermediary between the uneven cavity bottom and the passive component. It mediates the mechanical interface, providing a stable foundation that decouples the component positioning from the variations in cavity depth, thereby improving alignment precision without changing the overall package area.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Area of stationary object

If passive components are embedded in blind cavities of substrate, then device integration is improved and surface area is reduced, but mechanical stability deteriorates due to inconsistent cavity heights and uneven bases

Engineering Contradiction:

Improvepackage surface areaVSAvoidmechanical stability of embedded component

Core Design Contradiction:

Area of stationary objectVSStability of the object's composition

Solution Approach 1:

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The leveler layer changes the physical parameters of the cavity bottom by providing a uniform thickness and flat surface. This parameter modification stabilizes the mechanical environment for the embedded component, ensuring consistent positioning and reducing stress variations that would otherwise result from uneven cavity bases.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If blind cavities are formed in substrate, then component embedding is enabled and integration is improved, but cavity height consistency deteriorates and base uniformity worsens

Engineering Contradiction:

Improvecomponent embedding capabilityVSAvoidcavity height consistency

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The leveler layer compensates for variations in cavity depth by providing an additional material layer that restores the surface to a uniform height. This parameter adjustment allows the use of blind cavities of varying depths while achieving consistent final surface levels, maintaining manufacturing precision despite variations in cavity formation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The leveler layer is applied as a preliminary step before component placement, creating a uniform foundation that masks underlying cavity height variations. This preliminary action enables the embedding process to proceed with high precision even when the cavities themselves exhibit height inconsistencies.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250309148A1Substrate with component embedded in a blind cavity

Publication Date: 2025.10.02 INTEL CORP

AI summary

A microelectronic assembly includes a component embedded into a substrate. The component may include one or more passive components, e.g., for power delivery to one or more components attached to the substrate. The component is embedded into a blind cavity, which extends part-way through the substrate. A metal pad may be included under the component, defining the bottom of the cavity. Alternatively, a polymer material may be included under the component, along the bottom of the cavity. The polymer may provide an even surface for mounting the component and ensure that the component is at the correct height in the substrate.