Blind-Mate Connector Reliability in Phased-Array Antennas
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Solution Overview
Problem
Existing methods fail to effectively evaluate the reliability of blind mating interconnections in phased-array antennas during the design phase, leading to time-consuming and labor-intensive adjustments when issues are discovered in prototype testing.
Innovation Solution
A method involving computer-aided design (CAD) to create a mathematical model, extract dimensional chains, establish a finite element model, and analyze structural deformation under various loads to assess mechanical and electrical reliability of blind mating interconnections, using load conditions like temperature, acceleration, and vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If full-system vibration tests are conducted during the prototype phase to evaluate blind mating interconnection reliability, then the reliability assessment is comprehensive, but the design process becomes time-consuming and labor-intensive
Solution Approach 1:
The patent applies preliminary action by conducting reliability evaluation during the design phase rather than waiting for prototype testing. The method calculates blind mating clearance variations under different load conditions (temperature, acceleration, vibration) before manufacturing, allowing designers to identify and correct potential reliability issues early in the development process, thus avoiding time-consuming iterative prototype testing
Solution Approach 2:
The patent uses computational modeling to create a virtual representation of the blind mating interconnection system. By establishing mathematical models that simulate the physical behavior of connectors under various loads, the method creates a digital copy that can be tested and evaluated without requiring physical prototypes, significantly reducing time and resource consumption while maintaining evaluation comprehensiveness
2Volume of moving object
If blind mating interconnection structures are designed with small mating clearances to achieve low profile and high integration, then the antenna size is reduced, but the structure becomes more sensitive to deformation and misalignment
Solution Approach 1:
The patent applies preliminary action by calculating and analyzing blind mating clearance variations under different load conditions during the design phase. By predicting how temperature changes, acceleration, and vibration will affect clearance dimensions before manufacturing, designers can optimize the small clearance dimensions to ensure proper mating while achieving compact antenna size, thus resolving the conflict between miniaturization and precision requirements
Solution Approach 2:
The patent employs parameter changes by systematically varying clearance dimensions and analyzing their impact under different environmental loads. The method calculates clearance variations as a function of temperature, acceleration, and vibration parameters, allowing designers to select optimal clearance values that maintain manufacturing precision while minimizing antenna volume for low-profile applications
3Device complexity
If blind mating interconnections are used to achieve multiple connection levels and high integration, then the structure becomes more compact, but the reliability under harsh external loads decreases
Solution Approach 1:
The patent applies preliminary action by evaluating the reliability of multi-level blind mating interconnections under harsh external loads during the design phase. The method calculates clearance variations caused by temperature, acceleration, and vibration for each connection level, allowing designers to identify potential failure points and optimize the integrated structure before manufacturing, thus ensuring reliability while maintaining high integration
Solution Approach 2:
The patent applies segmentation by analyzing each blind mating connection level independently through separate dimensional chains. The method divides the complex multi-level interconnection system into individual connector levels, calculating clearance variations for each level under different loads. This segmented approach allows targeted optimization of each connection while maintaining overall system integration and reliability under harsh conditions
Data Source
AI summary
A method for evaluating reliability of blind mating interconnection of a phased-array antenna, in which a mathematical model of the phased-array antenna is obtained by computer aided design (CAD) to calculate a blind mating clearance tolerance for each level; a non-load-bearing structure within the CAD mathematical model is simplified to establish a finite element model; load conditions are introduced for structural deformation analysis to obtain blind mating clearance variations of blind mate connectors; blind mate clearance variations of blind mate interconnections and the blind mating clearance tolerance are summed to determine whether mechanical reliability of the phased-array antenna is unqualified; if yes, the evaluation is ended; otherwise, a total blind mating clearance variation of individual blind mating connectors caused by temperature, acceleration overload, and random vibration load is calculated to determine whether electrical reliability of the phased-array antenna is qualified.