Blind-Mate Optical Backplane Connector With Opto-Electric Cards
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Solution Overview
Problem
Current PCB-based backplane connector systems lack a blind-mate optical interface, limiting their ability to efficiently convert between electrical and optical signals and requiring complex alignment processes.
Innovation Solution
A daughter-card connector assembly with a blind-mate optical connector and opto-electric cards featuring a printed circuit board with optical components and waveguides for signal conversion, allowing for modular and scalable configurations with blind-mate optical interfaces along the edges for easy alignment and integration with backplane connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional pin and socket contact system is used, then electrical connection is established, but alignment complexity and field failure risk increase
Solution Approach 1:
The patent replaces the traditional mechanical pin and socket contact system with a PCB-based wafer connector system. The PCB wafer provides a planar connection interface that eliminates the need for individual pin alignment, thereby reducing alignment complexity while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges multiple individual pin connections into a single integrated PCB wafer structure. This consolidation reduces the number of alignment operations required while maintaining all necessary electrical connections, thereby reducing both alignment complexity and field failure risk.
2Adaptability or versatility
If optical components are added to convert between electrical and optical signals, then signal conversion capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the optical conversion functionality directly into the PCB wafer structure by integrating optical components (such as VCSELs, photodiodes, or optical modulators) with the electrical circuitry. This integration allows signal conversion capability to be added without proportionally increasing device complexity, as the optical and electrical systems share the same substrate and packaging.
Solution Approach 2:
The PCB wafer is designed to perform multiple functions simultaneously: electrical signal transmission, optical signal conversion, and interconnection. This multi-functionality allows the same device to handle both electrical and optical domains, improving adaptability while avoiding the need for separate dedicated components for each function.
3Ease of operation
If blind-mate optical interface is implemented, then alignment ease is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces complex mechanical alignment mechanisms with a blind-mate optical interface that relies on the PCB wafer's inherent structural features for alignment. The planar nature of the PCB provides natural alignment references, eliminating the need for complex mechanical adjustment mechanisms while maintaining ease of alignment during assembly.
Solution Approach 2:
The optical components and waveguides are pre-aligned and fixed to the PCB wafer during manufacturing, creating a pre-assembled unit with built-in alignment features. This preliminary alignment work is done during fabrication rather than during final assembly, making the blind-mate interface easier to implement while concentrating manufacturing complexity in the controlled fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient conversion between electrical and optical signals with improved alignment and scalability, reducing the need for extensive reconfiguration and replacement of entire systems, while providing flexible channel protection and pay-as-you-grow scalability.
Implementation Method 1
one or more waveguides connecting the optical component with the optical connector
Data Source
AI summary
A daughter-card connector assembly comprising: (a) a housing defining a first plane configured for mounting parallel to a backplane, and a second plane for mounting parallel to a daughter card, and a plurality of parallel slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots, and comprising at least, (i) a printed circuit board (PCB) defining at least a first edge and a second edge, wherein, when said opto-electric card is mounted in said slot, said first edge is parallel to said first plane and said second edge is parallel to said second plane; (ii) a blind-mate optical connector along said first edge; (iii) an electrical interface along said second edge; (iv) at least one optical component mounted on said PCB for converting between electrical and optical signals, said PCB being electrically connected to at least a portion of said electrical interface; and (v) one or more waveguides connecting said optical component with said optical connector.