Blind Rivet Nut Step Structure for Multi-Layer Plate Sealing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional blind rivet nuts face issues with installation distortion, poor bulging, and unreliable sealing in multi-layer plate connections of battery trays in electrical vehicles due to thickness variations and positional deviations, hindering mass production and optimization of lightweight battery frames.

Innovation Solution

A blind rivet nut design featuring a shank with a flange and step portion, an adhesive part, and a deformable portion, which allows for clearance fitting and deformation to securely fix and seal multi-layer plates, preventing deformation and enhancing sealing performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If conventional blind rivet nuts are used for multi-layer plate connections, then installation can be performed, but installation distortion and poor bulging occur due to thickness variations and positional deviations

Engineering Contradiction:
Improveinstallation capabilityVSAvoidinstallation distortion
Core Design Contradiction:
Ease of operationVSManufacturing precision

Solution Approach 1:

The patent introduces a step portion with a specific outer diameter larger than the shank, creating a two-stage fitting structure. The shank provides clearance fit for flexibility, while the step portion provides transition surface fit for positioning accuracy. This parameter differentiation resolves the contradiction by allowing both ease of installation and reduced installation distortion simultaneously.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The blind rivet nut is segmented into functional zones: the shank for insertion and bulging, the step portion for positioning and sealing, and the flange for load distribution. This segmentation allows each part to optimize its function, with the step portion specifically addressing the positioning accuracy issue while the shank handles the installation process.

Inventive Principle:
Principle #1Segmentation

2Weight of moving object

If conventional blind rivet nuts are used, then lightweight battery frames can be optimized, but flange deformation occurs during installation

Engineering Contradiction:
Improvebattery frame weightVSAvoidflange stability
Core Design Contradiction:
Weight of moving objectVSStability of the object's composition

Solution Approach 1:

The step portion with its larger outer diameter creates a transition surface that distributes installation forces more evenly. This parameter change prevents stress concentration at the flange edge, thereby preventing flange deformation while maintaining the lightweight design of the battery frame.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design ensures precise positioning and increased strength of the flange, preventing deformation and improving sealing and production yield by maintaining the plates' stability and providing a reliable sealing effect between the flange and plates.

Implementation Method 1

an adhesive part is disposed at a first side of the flange that is adjacent to the step portion

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20240068499A1Blind rivet nut for fixation and sealing
Publication Date: 2024.02.29 PENNENGINEERING AUTOMOTIVE FASTENERS (KUNSHAN) CO LTD
  • US20240068499A1 patent drawing
  • US20240068499A1 patent drawing
  • US20240068499A1 patent drawing

AI summary

A semiconductor package is disclosed. The semiconductor package comprises: a metal shim, a package substrate attached onto a front side of the metal shim, wherein the package substrate comprises an opening that passes therethough; one or more electronic components mounted on the package substrate; an encapsulant layer partially formed on the package substrate to expose a region of the package substrate and the opening of the package substrate, wherein the encapsulant layer encapsulates the one or more electronic components on the package substrate; a first connector mounted in the exposed region of the package substrate; a second connector mounted in the encapsulant layer and on the package substrate; and a magnet mounted in the opening of the package substrate and extending from the metal shim through the package substrate and the encapsulant layer.