Blind Via Capture Pad Structure Using Linear Laser Segmentation
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Solution Overview
Problem
The existing laser ablation process for forming blind via capture pads is slow due to the need to remove a large area of the dielectric layer and the inherent slowness of moving a focused laser beam in a helical motion, which increases costs and reduces the reliability of the electrical connection.
Innovation Solution
A capture pad structure with linear segments formed using a laser ablation process, where the focused laser beam moves in straight lines to create channels that are then filled with conductive material, reducing the area removed and increasing the speed of the process, and a blind via with an interlocking structure is formed to enhance the mechanical strength and reliability of the bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large area of dielectric layer is removed to form circular capture pad opening, then registration error compensation is improved, but processing time increases and productivity decreases
Solution Approach 1:
The circular capture pad is segmented into multiple linear segments arranged radially around the blind via. Instead of removing a large circular area of dielectric material, the patent creates narrow linear channels filled with conductive material. This segmentation maintains the electrical connection function while dramatically reducing the amount of dielectric removal required, thereby increasing processing speed and productivity without compromising registration error compensation.
Solution Approach 2:
The patent extracts only the essential function of the capture pad (providing electrical connection and registration tolerance) without removing unnecessary dielectric material. By taking out only the minimal required material to form linear channels rather than a large circular opening, the process achieves both reliability and productivity goals.
2Shape
If helical motion is used to move focused laser beam, then circular capture pad opening is formed, but processing time increases
Solution Approach 1:
Instead of using helical motion to create a circular opening, the patent inverts the approach by using linear back-and-forth motion to create radial linear segments. This inversion of the motion pattern and geometry dramatically reduces processing time while achieving the same functional result through filled linear channels rather than a circular opening.
Solution Approach 2:
The laser beam moves in periodic linear back-and-forth motions along radial lines to create the linear segments. This periodic linear action is much faster than continuous helical motion, reducing processing time while forming the required radial pattern of conductive segments.
3Ease of manufacture
If large area of dielectric layer is removed, then capture pad formation is achieved, but material loss increases and cost increases
Solution Approach 1:
The patent applies partial action by removing only the minimal necessary dielectric material to form narrow linear channels, rather than removing a large circular area. This partial removal achieves capture pad formation functionality while minimizing material loss and associated costs.
4Reliability
If conventional circular capture pad is used, then electrical connection is provided, but mechanical bond strength is insufficient
Solution Approach 1:
The capture pad is segmented into multiple linear segments arranged radially. The blind via structure includes corresponding radial features that interlock with these segments, creating multiple mechanical bond points around the circumference. This segmented radial design provides both electrical connection and enhanced mechanical bond strength through distributed interlocking.
Solution Approach 2:
The capture pad structure combines dielectric material with conductive material filled in the linear segments. The blind via structure combines dielectric material with conductive material and radial interlocking features. This composite construction provides both electrical conductivity and mechanical strength through the combination of materials and geometric interlocking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process is faster, more cost-effective, and provides a stronger bond between the blind via and the capture pad, improving the reliability of the electrical connection.
Implementation Method 1
A capture pad is formed using a laser ablation process. In accordance with this embodiment, the dielectric layer is laser-ablated to form channels therein.
Data Source
AI summary
A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.