Blind Via Embedding for Discrete Devices in PCBs
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Solution Overview
Problem
Existing methods for embedding electrical devices in printed circuit boards often result in increased thickness and unbalanced stack-up, requiring modifications to the standard manufacturing process and limiting the use of embedded devices in multi-layer boards due to the need for core thickness matching the device length.
Innovation Solution
A method involving the creation of blind vias in printed circuit boards after manufacturing, allowing electrical devices to be embedded without altering the standard process flow, where the via length is not limited by core layer thickness, enabling devices to be placed between conductive layers and reducing parasitic inductance and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electrical devices are embedded in printed circuit boards using existing methods, then component density can be increased, but the board thickness increases and stack-up becomes unbalanced
Solution Approach 1:
The electrical device is nested within the existing PCB structure by placing it in a blind via that extends into the board thickness. The device is positioned between conductive layers and surrounded by the PCB material, effectively nesting it within the existing structure rather than adding external thickness.
Solution Approach 2:
The invention transitions from surface-mounted or edge-mounted device placement to three-dimensional embedding within the board volume. By utilizing the vertical dimension through blind vias and positioning devices between conductive layers, the solution exploits the Z-dimension of the PCB structure to increase component density without proportionally increasing overall board thickness.
2Adaptability or versatility
If existing embedding methods are used, then electrical devices can be integrated in the board, but the manufacturing process requires modifications and core thickness must match device length
Solution Approach 1:
The blind via structure is prepared in advance during standard PCB manufacturing, creating pre-formed cavities that can accommodate electrical devices of various lengths. This preliminary preparation eliminates the need to match core thickness to device length, as the via provides a ready-made embedding space that accommodates different device dimensions without requiring custom manufacturing processes.
Solution Approach 2:
The blind via structure serves multiple functions: it provides mechanical support for the embedded device, establishes electrical connections to multiple conductive layers, and defines the embedding position. This multi-functional approach allows the same manufacturing structure to accommodate various device types and sizes without requiring process modifications.
3Reliability
If additional connecting vias are used for electrical connections, then electrical connectivity can be established, but parasitic inductance and resistance increase
Solution Approach 1:
The invention combines the mechanical support function and the electrical connection function into a single integrated structure. The blind via serves both as the housing for the embedded device and as the electrical connection pathway to multiple conductive layers, eliminating the need for separate connecting vias and thereby reducing parasitic inductance and resistance.
Solution Approach 2:
The solution extracts the electrical connection function from separate connecting vias and integrates it directly into the primary blind via structure. By taking out the need for additional connecting vias and incorporating all necessary electrical connections within the same via that houses the device, the design minimizes the total via count and reduces cumulative parasitic effects.
Data Source
AI summary
A method for embedding a discrete electrical device in a printed circuit board (PCB) is provided, which includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to a conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first device contact and the conductive structure in the first layer; and establishing a second electrical connection between a second device contact and a second layer, the second layer being one of the conductive layers of a second horizontal core section.