Blinded Infrared Detector Reference Pixels for Thermal Isolation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Infrared detectors within vacuum packages face challenges in measuring temperature variations, which can negatively impact image data quality due to the difficulty in isolating thermal influences from the surrounding environment.

Innovation Solution

The implementation of a device with a substrate and a floating or shunted blinded infrared detector, featuring a microbolometer thermally isolated from the substrate and a blocking structure to prevent external thermal radiation, along with a vacuum cavity to create a thermal isolation environment, allowing for the use of floating or shunted blinded infrared detectors to provide reference signals for correcting image data.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a vacuum package is used to thermally isolate the infrared detector from the surrounding environment, then thermal isolation performance is improved, but the ability to measure temperature variations within the package deteriorates due to difficulty in accessing temperature sensors

Engineering Contradiction:
Improvethermal isolationVSAvoidtemperature measurement
Core Design Contradiction:
Stability of the object's compositionVSMeasurement precision

Solution Approach 1:

The patent introduces a blocking structure with openings that serves as an intermediary element. This structure allows temperature sensors to measure temperature variations within the vacuum package while maintaining the vacuum seal and thermal isolation. The openings in the blocking structure enable sensor access without compromising the vacuum environment.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the infrared detector is thermally isolated from the substrate, then detector sensitivity is improved, but temperature reference measurement becomes difficult

Engineering Contradiction:
Improvedetector sensitivityVSAvoidtemperature reference
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The patent segments the detector system into multiple functional components: the floating infrared detector for sensitivity, the substrate for structural support, and reference pixels (both floating and shunted) for temperature measurement. This segmentation allows each component to perform its specific function optimally while working together as an integrated system.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The blocking structure serves multiple functions: it blocks external thermal radiation from reaching the detector, provides structural support, and enables temperature measurement through its openings. Additionally, the reference pixels serve dual purposes of temperature sensing and providing reference signals for detector calibration.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If external thermal radiation is blocked from the infrared detector, then measurement accuracy is improved, but the detector cannot distinguish between blocked radiation and actual scene radiation

Engineering Contradiction:
Improveimage data qualityVSAvoidthermal radiation information
Core Design Contradiction:
Measurement precisionVSLoss of information

Solution Approach 1:

The patent applies local quality by creating different thermal environments for different detector regions. The blocking structure selectively blocks external thermal radiation from specific detector pixels while allowing other pixels to receive scene radiation. Reference pixels are strategically positioned to measure specific temperature components, enabling the system to distinguish between different radiation sources through differential measurement.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively blocks external thermal radiation and allows for accurate temperature measurement within the vacuum package, enhancing the quality of infrared image data by providing correction signals for self-heating and substrate temperature variations.

Implementation Method 1

a vacuum cavity separating the microbolometer from the substrate

Methodology Applied
Scientific EffectVacuum: Vacuum

Implementation Method 2

thermally isolated from the substrate

Methodology Applied
Scientific EffectThermal isolation: Thermal Insulation

Implementation Method 3

The first blocking structure is configured to block external thermal radiation from being received by the first microbolometer

Methodology Applied
Scientific EffectThermal radiation blocking: Absorption (EM radiation)

Implementation Method 4

a first microbolometer coupled to and thermally isolated from the substrate

Methodology Applied
Scientific EffectBolometer: Bolometer

Implementation Method 5

The change in resistance of each infrared detector is translated into a time-multiplexed electrical signal

Methodology Applied
Scientific EffectInfrared radiation: Infrared Radiation

Data Source

PatentEP3243052B1Devices and methods for infrared reference pixels
Publication Date: 2020.10.07 TELEDYNE FLIR LLC
  • EP3243052B1 patent drawingFigure 1
  • EP3243052B1 patent drawingFigure 2
  • EP3243052B1 patent drawingFigure 3

AI summary

A device is disclosed including a substrate and a floating blinded infrared detector and/or a shunted blinded infrared detector. The floating blinded infrared detector may include an infrared detector coupled to and thermally isolated from the substrate; and a blocking structure disposed above the infrared detector to block external thermal radiation from being received by the infrared detector; and wherein the blocking structure comprises a plurality of openings. The shunted blinded infrared detector may include an additional infrared detector coupled to the substrate; an additional blocking structure disposed above the infrared detector to block external thermal radiation from being received by the additional infrared detector; and a material that thermally couples the additional infrared detector to the substrate and the additional blocking structure. Methods for using and forming the device are also disclosed.