Block Copolymer Adhesive Composition for Insulation and Thermal Creep
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Solution Overview
Problem
Existing adhesive compositions face challenges in achieving a balance between high adhesive force, insulation breakdown resistance, and thermal creep resistance, particularly in high-temperature environments and when exposed to static electricity, as they either degrade in adhesive force or lack sufficient insulation properties.
Innovation Solution
A block copolymer composition is developed, comprising a block (A) with a glass transition temperature of 75°C or higher, including a cyclic structure and carboxyl group-containing monomers, and a block (B) with a high acrylic acid ester unit, combined with a tackifier having a softening point of 120°C or higher and a cyclic structure, in a specific mass ratio, to enhance adhesive force, insulation breakdown resistance, and thermal creep resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If 50% to 90% by volume of boron nitride is blended as a heat diffusion filler, then insulation breakdown resistance is improved, but adhesive force degrades
Solution Approach 1:
The invention extracts the heat diffusion filler (boron nitride) from the adhesive composition entirely, relying instead on the intrinsic insulating properties of the block copolymer (X) and tackifier (Y) combination to provide insulation breakdown resistance without compromising adhesive force
Solution Approach 2:
The invention changes the chemical composition parameters by selecting specific block copolymer structures (with glass transition temperature of 75°C or higher and specific monomer units) and tackifiers (with softening point of 120°C or higher and cyclic structures) that inherently provide both adhesive force and insulation breakdown resistance
2Productivity
If adhesive layer thickness is decreased to reduce display size, then productivity is improved, but insulation breakdown resistance degrades
Solution Approach 1:
The invention changes the material composition parameters to use block copolymer (X) and tackifier (Y) with specific molecular structures and thermal properties that provide high insulation breakdown resistance even in thin adhesive layers, enabling both miniaturization and maintained reliability
3Reliability
If high-temperature resistance is improved for thermal creep resistance, then reliability in high-temperature environments is improved, but adhesive force may degrade
Solution Approach 1:
The invention segments the adhesive composition into two functional blocks: block (A) with glass transition temperature of 75°C or higher that provides thermal creep resistance and insulation stability, and block (B) that maintains adhesive force, allowing both high-temperature resistance and adhesive strength to coexist
Solution Approach 2:
The invention uses a composite material system combining block copolymer (X) with specific block composition and tackifier (Y) having cyclic structures, creating a material that exhibits both high thermal creep resistance and maintained adhesive force through synergistic interaction between components
Data Source
AI summary
An adhesive composition, includes a block copolymer (X) formed of a block (A) and a block (B), the block (A) having a glass transition temperature of 75°C or higher, the block (A) including a monomer unit having a first cyclic structure and a carboxyl group-containing monomer unit, the block (B) including 70% or more of an acrylic acid ester unit represented by General Formula (1); and a tackifier (Y) having a softening point of 120°C or higher and a second cyclic structure, in which a mass ratio of the block (A) to the block (B) (block (A)/block (B)) is 10/90 to 40/60, in an acid value of the block copolymer (X), an acid value derived from the block (A) is 8 mgKOH/g or more, at least one end of the block copolymer (X) is the block (A), a content of the tackifier (Y) is 5 to 40 parts by mass with respect to 100 parts by mass of the block copolymer (X), the General Formula (1) is CH2=CR1-COOR2, and R1 represents a hydrogen atom, and R2 represents a linear alkyl group or alkoxyalkyl group having 8 or less carbon atoms.