Block Copolymer Dielectric Loss Mechanical Strength
Solution Overview
Problem
Existing resin compositions struggle to achieve a balance between low dielectric loss tangent and high mechanical properties, such as high elongation and strength, particularly at high frequencies, which is crucial for insulating materials in electronic devices.
Innovation Solution
A block copolymer is developed through the copolymerization of polyamide and polyimide macromonomers with tetracarboxylic dianhydride and diamine compounds, resulting in a resin with a weight average molecular weight of 1,500 to 30,000, which forms a polyimide resin with improved dielectric and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If photosensitive resin composition is used to achieve low dielectric loss tangent, then dielectric properties are improved, but mechanical properties such as elongation and strength deteriorate
Solution Approach 1:
The invention uses a composite resin system combining polyimide resin and polyamide resin in specific proportions (polyimide resin 20-80 wt%, polyamide resin 80-20 wt%). This composite approach allows the polyimide component to provide low dielectric loss tangent while the polyamide component contributes high mechanical strength and elongation, resolving the contradiction between dielectric and mechanical properties
Solution Approach 2:
The invention optimizes the weight ratio parameters of polyimide and polyamide resins to achieve the best balance. By adjusting these compositional parameters within specific ranges, the resin composition achieves both low dielectric loss tangent (≤0.006 at 10 GHz) and high mechanical properties (tensile strength ≥60 MPa, elongation ≥10%), simultaneously improving both contradictory attributes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The block copolymer exhibits low dielectric loss tangent and high mechanical strength, enabling the production of resin films with enhanced electrical and mechanical properties suitable for high-frequency applications.
Implementation Method 1
a block copolymer including a copolymer resulting from copolymerization of: a macromonomer being a polyamide macromonomer and/or a polyimide macromonomer; a tetracarboxylic dianhydride and/or a dicarboxylic acid resulting from reaction of a tetracarboxylic dianhydride with an alcohol; and a diamine compound
Implementation Method 2
the polyamide macromonomer being a macromonomer resulting from polymerization of a diamine compound and a dicarboxylic acid resulting from reaction of a tetracarboxylic dianhydride with an alcohol
Implementation Method 3
the polyimide macromonomer being a polyamic acid macromonomer resulting from polymerization of a tetracarboxylic dianhydride and a diamine compound or being a macromonomer resulting from imidization of the polyamide macromonomer
Data Source
AI summary
A block copolymer which has a small dielectric loss tangent and excellent mechanical properties including elongation and strength; a polyimide resin which is produced by imidizing the block copolymer; a composition from which a resin film containing the block copolymer can be formed; and a method for producing a resin film using the composition. The block copolymer contains a block derived from a polyamide macromonomer and/or a block derived from a polyimide macromonomer, in which the block is produced by the copolymerization of a macromonomer that is a polyamide macromonomer and/or a polyimide macromonomer; a tetracarboxylic acid dianhydride and/or a dicarboxylic acid that is a reaction product of a tetracarboxylic acid dianhydride with an alcohol; and a diamine compound. In the block copolymer, the weight average molecular weight of the block is 1,500 to 30,000 inclusive.