Block Copolymer Hydride Sealing Resin for Organic Electronics
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Solution Overview
Problem
Existing organic electronic device sealing members experience significant degassing after the formation of their sealing layer, leading to gas entry into the device and deterioration of the organic material, which affects device performance and durability.
Innovation Solution
A sealing resin composition comprising a block copolymer hydride with 90% or more of its unsaturated bonds hydrogenated, combined with a hydrocarbon plasticizer, is used to reduce degassing and enhance sealing. The block copolymer includes aromatic vinyl and linear conjugated diene units, with a specific weight ratio and molecular weight range, and may contain an alkoxysilyl group for improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional sealing members (styrene-based elastomer or epoxy-based material) are used, then sealing function and coverage of irregular structure are achieved, but significant degassing occurs after layer formation
Solution Approach 1:
The patent changes the chemical composition parameters of the sealing member by using a block copolymer hydride with specific weight ratios (wA:wB of 20:80 to 60:40) and controlled molecular weight (30,000 to 200,000), combined with a hydrocarbon plasticizer at 1 to 50 parts by weight per 100 parts of block copolymer hydride. These parameter changes reduce degassing while maintaining sealing functionality.
Solution Approach 2:
The patent creates a composite sealing material combining block copolymer hydride (derived from aromatic vinyl and linear conjugated diene blocks) with hydrocarbon plasticizer. This composite structure provides both sealing performance and reduced degassing, resolving the contradiction between reliability and harmful gas emission.
2Reliability
If sealing member layer is formed with conventional materials, then sealing is achieved, but gas discharge enters the element and causes organic material deterioration
Solution Approach 1:
By changing the chemical parameters of the sealing material to block copolymer hydride with specific composition ratios and molecular weight, the patent reduces gas discharge that would otherwise penetrate the sealing layer and deteriorate organic materials, while maintaining the protective sealing function.
Solution Approach 2:
The patent converts the potential harm of gas discharge into a benefit by selecting materials (block copolymer hydride with high hydrogenation content) that inherently minimize gas evolution, thereby protecting the organic element from deterioration while maintaining effective sealing.
3Object-generated harmful factors
If block copolymer hydride with specific composition is used, then degassing is reduced, but formulation complexity increases
Solution Approach 1:
The patent establishes specific parameter ranges for the block copolymer hydride (weight fractions wA:wB of 20:80 to 60:40, molecular weight 30,000 to 200,000) and plasticizer content (1 to 50 parts by weight per 100 parts of block copolymer hydride). Within these ranges, the formulation achieves reduced degassing while maintaining manageable complexity through defined specifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves favorable sealing with reduced degassing, thereby suppressing organic material deterioration and enhancing the long-term durability and performance of organic electronic devices.
Implementation Method 1
a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer
Data Source
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AI summary
An organic electronic device sealing resin composition including a block copolymer hydride obtained by hydrogenating 90% or more of all unsaturated bonds of a block copolymer, wherein the block copolymer includes: two or more polymer blocks [A] per one molecule of the copolymer, the block having an aromatic vinyl compound unit as a main component; and one or more polymer blocks [B] per one molecule of the copolymer, the block having a linear conjugated diene compound unit as a main component, and a ratio between a weight fraction wA of all the polymer blocks [A] in the entire block copolymer and a weight fraction wB of all the polymer blocks [B] in the entire block copolymer (wA:wB) is 20:80 to 60:40.