Block Copolymer Self-Assembly for Semiconductor Security
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Solution Overview
Problem
Circuit counterfeiting in semiconductor devices poses a significant threat due to the ease of replicating security markings, allowing counterfeit units to be sold as genuine, potentially leading to critical system failures, especially with the rise of IoT devices.
Innovation Solution
Implementing a unique self-assembly (SA) pattern created using block copolymers on integrated circuits, which generates random and unpredictable patterns that serve as a 'fingerprint' for identification, stored and verified through a secure database, allowing for efficient and secure authentication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional security markings (printed data, bar codes, fluorescent inks) are used on semiconductor devices, then security verification can be performed, but the markings can be easily replicated and counterfeited
Solution Approach 1:
The patent applies preliminary action by creating unique self-assembly patterns during the semiconductor manufacturing process itself, before the device is completed. These patterns are generated through block copolymer self-assembly and annealing processes that occur during fabrication, embedding the security feature inherently rather than adding it later. This preliminary creation ensures the patterns are difficult to replicate as they depend on specific manufacturing conditions that are hard to reproduce exactly.
Solution Approach 2:
The patent utilizes self-service through the self-assembly property of block copolymers. The block copolymer material automatically forms unique patterns through its own self-organization behavior during annealing, without requiring external guidance or control. This self-service mechanism creates inherently unique patterns that are difficult to replicate because they arise from spontaneous self-organization under specific thermal conditions, making counterfeiting extremely difficult while maintaining security verification capability.
2Reliability
If complex security patterns are implemented to prevent counterfeiting, then security is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies parameter changes by utilizing the thermal annealing process parameters to control block copolymer self-assembly. By adjusting temperature, time, and cooling rates during manufacturing, unique patterns emerge from the same material system. This approach creates high-security patterns without adding complex manufacturing steps, as the complexity arises naturally from parameter variations in an existing polymer annealing process rather than from additional fabrication steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The unique SA patterns provide a high level of security by making it impossible to clone, thus effectively preventing counterfeiting and ensuring the authenticity of semiconductor products, even in resource-constrained IoT devices.
Implementation Method 1
An image of a self-assembly (SA) pattern on a substrate from a scanner is received. The SA pattern has been initially created using a block copolymer (BCP) which has been annealed on the substrate.
Data Source
AI summary
Verifying a semiconductor product is disclosed. An image of a self-assembly (SA) pattern on a substrate from a scanner is received. The SA pattern has been initially created using a block copolymer (BCP) which has been annealed on the substrate. Data from the SA pattern is stored in a computer system. The SA pattern data is associated with the semiconductor product. The SA pattern is an information carrying security mark having a set of features with corresponding locations within the information carrying security mark which uniquely identify the semiconductor product.