Blocking Plate Buffer Layout for Uniform Supercritical Substrate Drying
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Solution Overview
Problem
The collapse of semiconductor patterns during the drying process due to fluid surface tension leads to defects and reduced performance in semiconductor devices.
Innovation Solution
A substrate processing apparatus with a process chamber, a blocking plate, and a buffer structure that reduces eddy currents and enhances fluid flow uniformity using a supercritical fluid system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fluid is used during the drying process, then chemical solutions are removed from the semiconductor device, but surface tension of the fluid causes collapse of the semiconductor pattern
Solution Approach 1:
The patent changes the physical parameters of the fluid by using supercritical carbon dioxide instead of conventional liquid solvents. By adjusting temperature and pressure to achieve supercritical state, the fluid's surface tension is eliminated while maintaining effective drying capability, thus resolving the contradiction between drying effectiveness and pattern collapse prevention
Solution Approach 2:
The patent utilizes phase transition of carbon dioxide from supercritical state to gas state for drying. The supercritical fluid penetrates the semiconductor structure effectively, then transitions to gas phase for removal, avoiding liquid surface tension that causes pattern collapse while maintaining drying reliability
2Reliability
If conventional drying methods are used, then chemical solutions are removed, but eddy currents are generated inside the process chamber causing non-uniform fluid flow
Solution Approach 1:
The patent introduces a blocking plate as an intermediary component that redirects fluid flow. The blocking plate prevents direct impingement of supercritical fluid on the substrate, creating a more uniform flow distribution and reducing eddy currents while maintaining complete drying through the buffer space design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents semiconductor pattern collapse and improves fluid flow uniformity, thereby maintaining device quality and performance.
Implementation Method 1
A substrate processing apparatus according to some embodiments of the inventive concept may include a process chamber defining a process space, a first support disposed in the process space, a blocking plate supported by the first support, and a buffer extending downward from a lower surface of the blocking plate... configured to reduce eddy currents inside a process chamber
Implementation Method 2
An object of the inventive concept is to provide a substrate processing apparatus configured to increase uniformity of a flow of a supercritical fluid on a substrate
Data Source
AI summary
A substrate processing apparatus includes a process chamber defining a process space, a first support disposed in the process space, a blocking plate supported by the first support, and a buffer extending downward from a lower surface of the blocking plate.