Blocking Ring Prevents Parasitic Plasma in Substrate Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
During substrate processing in semiconductor and display processing apparatuses, parasitic plasma is generated in the lower space due to gas penetration from the reaction space, reducing the plasma capacity available for the substrate and causing process failures.
Innovation Solution
A substrate processing apparatus is designed with a blocking ring that surrounds the substrate support device, preventing gas from the reaction space from penetrating into the lower space by forming a barrier that contacts the substrate support device and control ring, thereby blocking the formation of parasitic plasma.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If gas flow rate is increased to improve substrate processing efficiency, then productivity is improved, but gas penetration into lower space increases causing parasitic plasma generation
Solution Approach 1:
A blocking ring is introduced as an intermediary component between the reaction space and lower space. The blocking ring physically intercepts and blocks the gas flow path, preventing source/reaction gases from penetrating into the lower space while allowing the gas flow rate in the reaction space to be maintained at high levels for efficient substrate processing.
Solution Approach 2:
The blocking ring segments the continuous gas flow path into two separate regions: the reaction space where high gas flow rate is maintained for substrate processing, and the lower space where gas penetration is blocked. This segmentation allows independent control of gas flow characteristics in each region, enabling high productivity without parasitic plasma.
2Productivity
If RF power is supplied to increase plasma capacity for substrate processing, then productivity is improved, but parasitic plasma generation in lower space increases reducing effective plasma capacity
Solution Approach 1:
The blocking ring serves as a physical intermediary that prevents the coupling between RF power supply and the lower space. By blocking the gas penetration path, it prevents the formation of parasitic plasma that would otherwise be generated in the lower space when RF power is supplied, thereby preserving plasma capacity for effective substrate processing.
3Manufacturing precision
If gap between control ring and substrate support device is reduced to improve plasma uniformity, then manufacturing precision is improved, but gas penetration into lower space is facilitated
Solution Approach 1:
The blocking ring addresses the gas penetration problem by introducing a new spatial dimension (radial blocking at the bottom of the gap) rather than simply reducing the gap width. This allows the gap to remain sufficiently wide for plasma uniformity while the blocking ring prevents gas flow through the gap from reaching the lower space.
Data Source
AI summary
A substrate processing apparatus includes one or more reactors, which physically prevent a process gas in a reaction space from penetrating into a space other than the reaction space. Furthermore, provided is a substrate processing apparatus capable of minimizing the occurrence of parasitic plasma in a space other than a reaction space.