Blood Pump Epoxy Bonding for Moisture Ingress Control
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Solution Overview
Problem
Blood pumps experience performance degradation due to moisture ingress at the interface between epoxy and sleeve or yoke, leading to leakage current and reduced heat transfer efficiency.
Innovation Solution
Applying a silane-based primer to treat the surfaces of the yoke, coil, and sleeve before encapsulating them with epoxy to enhance surface wettability and adhesion, thereby preventing moisture ingress and improving bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If epoxy is used to encapsulate the coil between the yoke and sleeve, then structural stability is improved, but moisture ingress occurs at the interface leading to leakage current
Solution Approach 1:
A primer layer is introduced as an intermediary between the epoxy and the substrate surfaces (yoke, coil, sleeve). This primer layer improves adhesion and prevents moisture ingress at the interface, thereby eliminating leakage current while maintaining the structural stability provided by the epoxy encapsulation.
Solution Approach 2:
The substrate surfaces (yoke, coil, sleeve) are treated with a primer before the epoxy encapsulation process. This preliminary treatment enhances the bonding strength between the epoxy and substrates, preventing future moisture ingress and ensuring long-term reliability by addressing adhesion issues before they occur.
2Ease of manufacture
If epoxy encapsulation is applied without surface treatment, then manufacturing simplicity is maintained, but adhesion strength is insufficient leading to interface degradation
Solution Approach 1:
The substrate surfaces are treated with a primer before epoxy application. This preliminary step, while adding a process step, significantly enhances adhesion strength and prevents interface degradation, ensuring the long-term structural integrity of the encapsulated motor components.
3Temperature
If moisture ingress occurs at the epoxy interface, then heat transfer efficiency is reduced, but the epoxy encapsulation structure remains intact
Solution Approach 1:
The primer layer acts as an intermediary that creates a moisture barrier at the epoxy-substrate interface. This prevents moisture ingress that would otherwise degrade heat transfer efficiency, while the epoxy encapsulation structure remains intact and structurally stable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The primer treatment significantly reduces leakage current and ensures reliable pump operation by enhancing the adhesion between the epoxy and the substrate surfaces, maintaining structural integrity and heat transfer efficiency.
Implementation Method 1
Applying a silane-based primer to treat the surfaces of the yoke, coil, and sleeve before encapsulating them with epoxy to enhance surface wettability and adhesion
Implementation Method 2
enhance surface wettability and adhesion, thereby preventing moisture ingress and improving bonding strength
Implementation Method 3
The coil is embedded in epoxy, with the epoxy at the yoke/coil interface and the coil/sleeve interface
Implementation Method 4
an impeller or rotor is rotatably supported with the pump casing about an axis of rotation, with the impeller being provided with one or more impeller blades for conveying blood
Implementation Method 5
The motor 100 has a stator 120 and a rotor 130
Data Source
AI summary
A blood pump with a stator and rotor wherein the rotor is assembled by bonding the stator components with epoxy. The bonding surfaces of the rotor components are primed with a silane-based primer to improve adhesion between the primer and the rotor components by rendering such surfaces hydrophobic. A bonding surface of one of the stator yoke or the stator sleeve, or both, is treated with a primer that improves wettability of the bonding surface and improves bonding of the epoxy to the binding surface. The device has a bonding surface adhered to epoxy in which a primer was applied on such bonding surface prior to introducing epoxy onto the bonding surface. In addition to improved bond strength, hydrophobic surface would control moister ingress.