Board Level Shield Pickup Member Rotating In Place
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional board level shields face challenges in achieving co-planarity and reducing residual stress during the drawing process of a raised 'pick and place' bridge, which can lead to twisting or lifting of the frame during reflow solder operations.
Innovation Solution
The design allows the pickup island of the board level shield's pickup member to rotate in place during the drawing process, reducing the needed elongation of the metal bridge and thereby minimizing residual stress, with offset bridge-to-island attachments maintaining the island's center position and ensuring co-planarity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the pickup member is drawn to raise the pickup area, then the pickup area can be positioned higher for easier component access, but the frame experiences twisting and lifting due to residual stress
Solution Approach 1:
The pickup area is designed with rotational capability, allowing it to rotate in place during the drawing process. This dynamic adjustment enables the pickup area to adapt its position while being raised, preventing frame twisting and maintaining stability throughout the operation.
Solution Approach 2:
The drawing process parameters are modified to include rotational movement of the pickup area. By changing the movement parameters from purely linear to rotational plus linear, the system achieves both height increase for component access and stress reduction for frame stability.
2Ease of operation
If the pickup area is raised during drawing, then component clearance is improved, but co-planarity is degraded due to frame distortion
Solution Approach 1:
The pickup area rotates in place during the drawing process, which dynamically adjusts its position to maintain co-planarity with the frame. This rotational movement compensates for the frame distortion that would otherwise occur during raising, ensuring precise alignment is maintained.
Solution Approach 2:
The rotational capability is built into the design beforehand to counteract the frame twisting and lifting that occurs during the drawing process. This preliminary design feature prevents co-planarity degradation before it can occur during soldering operations.
3Ease of manufacture
If conventional drawing process is used, then manufacturing is simpler, but residual stress causes frame lifting during reflow solder
Solution Approach 1:
The pickup area is designed with rotational freedom that allows it to move during the drawing process. This dynamic capability reduces the buildup of residual stress by enabling stress relief movement, thereby preventing frame lifting during reflow solder without significantly complicating manufacturing.
Solution Approach 2:
The rotational capability is incorporated into the design before the drawing process, allowing stress relief to occur during manufacturing. This preliminary design feature prevents frame lifting during subsequent reflow solder operations by addressing residual stress issues in advance.
Data Source
AI summary
According to various aspects, exemplary embodiments are disclosed of board level shield (BLS) frames or fences including pickup members with pickup areas. In exemplary embodiments, the pickup member may be configured such that the pickup area is allowed to rotate in place when the pickup member is drawn to raise the pickup area.