Bluetooth Thermocouple Probe for Fast, Accurate Meat Temperature Sensing

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Solution Overview

Problem

Conventional temperature probes suffer from inaccurate temperature measurement due to indirect heat transfer through insulating materials and air gaps, leading to delayed responses and significant measurement errors, and face difficulties in penetrating thick meat products with bulky needle tips.

Innovation Solution

A Bluetooth temperature probe with a field-configurable thermocouple assembly, a flat sharp-edged ceramic or stainless steel tip, and multiple thermocouple assemblies along the PCB, enabling direct mechanical contact and real-time temperature monitoring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional NTC thermistor sensors are used with insulating materials or air gaps between sensor and probe housing, then the probe structure is simple, but temperature measurement precision deteriorates due to indirect heat transfer

Engineering Contradiction:
Improvetemperature measurement precisionVSAvoidprobe structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent extracts the temperature sensing function from the conventional NTC thermistor design and implements it through a thermocouple assembly with direct metal-to-metal contact. The thermocouple wires are inserted through the probe housing directly onto the heating element, eliminating the need for insulating materials or air gaps that compromised thermal contact in conventional designs.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the conventional NTC thermistor-based electrical resistance sensing system with a thermocouple-based voltage generation system. The thermocouple assembly generates a voltage signal through the Seebeck effect when exposed to temperature differences, providing a different physical mechanism for temperature detection that enables direct contact with the heating element.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Speed

If conventional NTC sensors are used, then the probe design is simple, but response time deteriorates due to indirect thermal conduction

Engineering Contradiction:
Improvetemperature response speedVSAvoidsensor assembly complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent segments the temperature sensing function into multiple thermocouple assemblies positioned at different locations along the heating element. Each thermocouple assembly independently measures temperature at its specific position, allowing the system to capture temperature gradients and respond to thermal changes at multiple points simultaneously, thereby improving overall response speed.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces thermocouple wires as intermediary elements that directly contact the heating element to transfer thermal energy to the sensing junctions. This intermediary contact path eliminates the thermal resistance introduced by insulating materials and air gaps in conventional designs, enabling faster heat transfer and more rapid temperature detection.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If a singular tapered tip geometry is used, then the probe structure is simple, but ease of operation deteriorates due to excessive resistance during insertion

Engineering Contradiction:
Improveprobe insertion easeVSAvoidtip geometry complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent applies local quality by providing different geometric characteristics at different sections of the probe tip. The proximal end of the tip features a flat, broad surface for easy insertion and minimal resistance, while the distal end maintains a tapered configuration for effective penetration. This localized variation in geometry optimizes both insertion ease and penetration capability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent incorporates curved surfaces and rounded transitions in the probe tip geometry, particularly at the junction between the flat proximal surface and the tapered distal end. These curved transitions reduce stress concentration and minimize resistance during insertion while maintaining the functional requirements for both easy insertion and effective penetration.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The probe achieves ±0.5°C accuracy with reduced latency by 60% and enhanced insertion capability, ensuring precise temperature control and optimal cooking results.

Implementation Method 1

A thermoelectric potential is generated between the constantan spring contact and the copper-clad pad on the PCB when the temperature sensing junction detects thermal changes

Methodology Applied
Scientific EffectSeebeck effect: Seebeck Effect

Implementation Method 2

Direct mechanical contact between the temperature sensing junction (metal ball) of the field-configurable thermocouple assembly and the probe housing eliminates intermediate insulating layers

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260016345A1Bluetooth Temperature Probe and Temperature Measurement Device
Publication Date: 2026.01.15 SHENZHEN QIJUN ELECTRONIC TECHNOLOGY CO LTD
  • US20260016345A1 patent drawing
  • US20260016345A1 patent drawing
  • US20260016345A1 patent drawing

AI summary

The present application discloses a Bluetooth temperature probe and temperature measurement device, comprising a handle assembly, a printed circuit board, a probe housing, a battery, an antenna, and a probe tip. It is characterized in that: the Bluetooth temperature probe is provided with a field-configurable thermocouple assembly. The field-configurable thermocouple assembly is formed by spot-welding a constantan spring contact to a copper-clad pad on the printed circuit board, wherein the constantan spring contact abuts against the probe housing. A metal ball formed by the spot welding serves as a temperature sensing junction of the field-configurable thermocouple assembly for temperature measurement.