BMS Board Through-Hole Insulation for Safe Battery Wire Soldering
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Solution Overview
Problem
The existing battery management systems (BMS) are prone to electrical damage when wires extending from battery cells are soldered onto a board to connect the battery cells and the BMS, especially when the connection is not sequential from the low battery bank.
Innovation Solution
A battery apparatus with a board that has laminated insulation and conductive layers, featuring through-holes with non-conductive layers on the inside surfaces and a conductive pattern spaced from the through-holes, prevents electrical connections before soldering, thus protecting the BMS from damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are soldered onto the board to connect battery cells and BMS, then electrical connection is established, but electrical damage may occur to the BMS when connection is not sequential
Solution Approach 1:
An insulation layer is introduced as an intermediary between the wire and the conductive pattern on the board. This insulation layer prevents direct electrical contact until the wire is properly inserted into the through-hole, thereby preventing electrical damage to the BMS regardless of connection sequence. The mediator (insulation layer) ensures safe operation during the soldering process.
Solution Approach 2:
The conductive pattern is preliminarily formed on the board at a position spaced apart from the through-hole, and the insulation layer is preliminarily applied to the wire or board. This preliminary arrangement ensures that even if wiring is performed in incorrect sequence, the BMS is protected from electrical damage because the conductive path is not yet established.
2Area of stationary object
If conductive pattern is placed close to through-hole for compact design, then board area is reduced, but electrical damage risk increases due to possible contact before soldering
Solution Approach 1:
The insulation layer serves as a mediator that allows the conductive pattern to be placed close to the through-hole for compact design while simultaneously preventing harmful electrical contact during the soldering process. The insulation layer bridges the gap between compact design requirements and electrical safety.
Solution Approach 2:
The insulation property is locally applied where needed - on the insulation layer covering the conductive pattern or lining the through-hole. This local quality approach allows compact overall design while providing targeted electrical isolation exactly where the wire and conductive pattern might contact before soldering.
Data Source
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AI summary
Provided are a battery apparatus including: at least one battery pack including a plurality of battery cells; a battery management system (BMS) configured to manage the plurality of battery cells; a board to which the BMS is mounted and on which at least one insulation layer and a conductive layer are laminated; a plurality of wires extending from the battery cells onto the board; a plurality of through-holes which are formed in the board and to which the plurality of wires are respectively inserted; a non-conductive area formed on at least one area around the through-hole; and a soldering part formed on the through-hole to which the wire is inserted, and a method of manufacturing the same.