BMS Board Through-Hole Insulation for Safe Battery Cell Soldering
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Solution Overview
Problem
Existing battery management systems (BMS) are prone to electrical damage when wires connecting battery cells to the BMS are soldered randomly, leading to malfunctions due to improper sequencing of connections, which can apply voltages greater than the allowable limit to integrated circuits.
Innovation Solution
The solution involves forming non-conductive layers inside through-holes on a board where wires connect to the BMS, ensuring that electrical contact is prevented until a soldering part is formed, and maintaining a predetermined distance between the conductive pattern and the through-hole to prevent premature electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wires are soldered to connect battery cells to BMS without sequential ordering, then manufacturing process is simplified and productivity is improved, but electrical damage to BMS IC occurs due to improper voltage application
Solution Approach 1:
A non-conductive layer is formed at the bottom of the through-hole before wire insertion and soldering. This preliminary protective action ensures that even if wires are soldered in random sequence, the BMS IC cannot receive improper voltage because the non-conductive layer physically prevents electrical contact until the correct grounding sequence is established.
Solution Approach 2:
The non-conductive layer acts as an intermediary barrier between the wire and the BMS IC mounting surface. It mediates the electrical connection process by initially blocking contact and only allowing connection after proper sequencing, thus protecting the BMS from electrical damage while enabling simplified manufacturing.
2Device complexity
If through-holes are formed directly on the board without non-conductive layers, then device complexity is reduced and manufacturing is easier, but electrical damage occurs due to premature contact between wires and conductive paths
Solution Approach 1:
The through-hole structure is segmented into distinct functional zones: a non-conductive bottom layer for protection, a middle section for wire insertion, and a top section for soldering. This segmentation allows the single through-hole structure to simultaneously provide mechanical support, electrical isolation, and controlled connection, resolving the contradiction between simplicity and safety.
3Reliability
If battery cells are connected to BMS in strict sequential order from low to high voltage, then electrical safety is ensured, but manufacturing time increases and productivity decreases
Solution Approach 1:
The non-conductive layer configuration enables the soldering process to self-regulate the connection sequence. When wires are soldered in random order, the grounding wire automatically establishes the reference potential first due to its direct path to the non-conductive layer interface, and subsequent voltage wire connections naturally follow the correct sequence without external control, thus maintaining safety while enabling parallel processing.
Data Source
AI summary
Provided are a battery apparatus including: a battery pack including a plurality of battery cells; a battery management system (BMS) for managing the plurality of battery cells; a board to which the BMS is mounted, the board including an insulation layer and a conductive layer; a plurality of wires extending from the plurality of battery cells onto the board; a plurality of through-holes formed in the board, the plurality of wires extending through the plurality of through-holes; a plurality of non-conductive areas, each of the plurality of non-conductive areas being formed on an area around a respective one of the plurality of through-holes; and a plurality of soldering parts, each of the plurality of soldering parts being formed on the respective one of the plurality of through-holes.