Boron Nitride Nanosheet Composite for In-Plane Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages and displays suffer from low thermal conductivity and mechanical strength due to the use of lightweight polymers, leading to reduced device lifespan and performance degradation from heat generation.
Innovation Solution
A nanosheet-reinforced composite material is developed, comprising a polyketone-based polymer film layer and a boron nitride filler layer, which are laminated to enhance thermal conductivity and mechanical strength through a multilayer structure, with boron nitride arranged in the plane direction and pressurized and heated to form a heat transfer path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If lightweight polymers are used in semiconductor packages and displays, then weight is reduced, but thermal conductivity and mechanical strength deteriorate
Solution Approach 1:
The patent creates a composite material by combining lightweight polymer matrices with boron nitride nanosheets. The nanosheets are dispersed within the polymer to form a composite structure that maintains the low weight of the polymer while introducing high thermal conductivity pathways through the boron nitride particles, thereby resolving the contradiction between weight reduction and thermal conductivity maintenance
2Weight of moving object
If lightweight polymers are used in semiconductor packages and displays, then weight is reduced, but mechanical strength deteriorates
Solution Approach 1:
The patent employs composite material construction where boron nitride nanosheets serve as reinforcement within the lightweight polymer matrix. The nanosheets provide structural support and enhance mechanical strength through their high aspect ratio and intrinsic strength properties, while the polymer matrix maintains overall lightness, thus resolving the weight-strength tradeoff
3Temperature
If nanofillers with high thermal conductivity are added to polymers, then thermal conductivity is improved, but device complexity increases
Solution Approach 1:
The patent optimizes the concentration and dispersion parameters of boron nitride nanosheets within the polymer matrix. By carefully controlling the nanofiller loading level and using appropriate processing conditions to achieve uniform dispersion, the patent enhances thermal conductivity while avoiding the complexity that would arise from excessive filler content or poor dispersion, thus resolving the contradiction between thermal performance and device simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material achieves improved thermal conductivity up to 471% enhancement and maintains tensile strength, with thermal conductivity in the plane direction reaching 1.522 W/mK and tensile strength of 100 MPa or more, effectively managing heat dissipation and mechanical rigidity.
Implementation Method 1
thermal conductivity of the nanosheet-reinforced composite material in a plane direction may be 0.27 W/mK or more
Implementation Method 2
a heat sink is mounted on the electronic components that generate heat
Data Source
AI summary
The present disclosure relates to a boron nitride nanosheet-reinforced composite material having excellent thermal and mechanical properties and a method for producing the same. The boron nitride nanosheet-reinforced composite material has a multilayer structure, which is an ideal structure for improving thermal conductivity in a plane direction, and can enhance an elastic modulus and maintain a tensile strength by the multilayer structure of a polymer and a filler.