BN-PCM Composite Thermal Material for Heat Storage and Dissipation
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Solution Overview
Problem
Current thermal management techniques for electronic components are inadequate in limiting temperature increase, especially in compact and lightweight designs, as they either lack efficiency in heat dissipation or risk short-circuiting due to high thermal conductivity materials.
Innovation Solution
A composite material comprising a continuous structure of Boron Nitride (BN) with a Phase Change Material (PCM) embedded in a polymer coating, where the BN structure is devoid of PCM on external faces to prevent leakage and enhance thermal conductivity while maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If Phase Change Material (PCM) is used to absorb and store heat, then thermal storage capacity is improved, but thermal conductivity remains low (0.15-0.25 W/mK)
Solution Approach 1:
The patent combines PCM with boron nitride (BN) particles to create a composite thermal management material. The BN particles form a conductive network within the PCM matrix, enabling heat to be rapidly distributed throughout the material while the PCM absorbs thermal energy through phase change. This composite structure simultaneously achieves high thermal conductivity and high thermal storage capacity.
2Temperature
If materials with high thermal conductivity are used to improve heat dissipation, then thermal conductivity is improved, but electrical insulation is compromised due to risk of short-circuiting
Solution Approach 1:
The patent utilizes boron nitride particles which possess anisotropic thermal conductivity properties. The BN particles are oriented and distributed to create preferential thermal conduction pathways that are spatially localized, allowing heat to be efficiently conducted in specific directions while maintaining electrical insulation in other directions. This local optimization of thermal transport paths resolves the contradiction between thermal conductivity and electrical insulation.
3Volume of moving object
If compactness of electronics is increased, then miniaturization is achieved, but thermal management becomes more difficult due to confined surroundings
Solution Approach 1:
The patent exploits the phase transition properties of PCM materials which undergo solid-liquid phase change at specific temperatures. During operation, the PCM absorbs excess heat from electronic components by transitioning from solid to liquid phase, effectively managing thermal loads in compact spaces. This phase change mechanism provides high thermal storage density without requiring large volumes, making it ideal for miniaturized electronic systems.
4Temperature
If thermal interface materials are used to reduce thermal contact resistance, then heat transfer is improved, but thermal storage capacity is lost as these materials do not store heat
Solution Approach 1:
The patent merges the functions of thermal interface material and thermal storage material into a single composite material system. The boron nitride-enhanced PCM serves both as a thermal conductor (reducing contact resistance) and as a thermal energy storage medium. This integration eliminates the need for separate thermal interface layers and storage components, achieving both low thermal contact resistance and high thermal storage capacity in one material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite material effectively increases thermal conductivity by 477% and provides improved thermal storage capacity, adaptability, and electrical insulation, ensuring efficient heat absorption and dissipation without compromising the electronic components.
Implementation Method 1
these materials have the capacity to store surrounding heat thanks to their high enthalpy of fusion (typically around 210 J/g), wherein, by absorbing the heat, they limit the increase in temperature of their surroundings
Implementation Method 2
these materials have the capacity to store surrounding heat thanks to their high enthalpy of fusion (typically around 210 J/g)
Implementation Method 3
BN is an excellent electrical insulator while being an excellent thermal conductor. By mixing BN with a PCM, we may increase the thermal conductivity of the PCM, and, therefore, its thermal storage capacity
Data Source
AI summary
The invention relates to a composite material based on boron nitride (BN(C)) in the form of a continuous structure; and a phase change material (PCM) incorporated within said continuous BN(C) structure and is embedded within a polymer layer, a process for manufacturing same, and the components that comprise same.