Sport Board Bumper Overmolding Eliminates Detachment
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Solution Overview
Problem
Current manufacturing methods for sport equipment boards are time-consuming, labor-intensive, and wasteful, and traditional protective bumpers tend to detach from the board, leading to inefficiencies and material waste.
Innovation Solution
The method involves molding a substrate with a board bumper using overmolding, which integrates the bumper directly onto the edge of the substrate, reducing the need for extra fasteners or adhesives and eliminating the need for additional finishing steps like sanding, while using closed mold manufacturing to form a fiber-reinforced plastic around a shaped core, thereby streamlining the production process and enhancing the board's durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separate assembly of bumpers using screws or adhesives is used, then the bumper can be attached to the board, but the bumper tends to detach and requires additional assembly steps
Solution Approach 1:
The bumper and board are merged into a single integrated component through overmolding. The bumper material is molded directly onto the substrate edge in one continuous process, eliminating the need for separate assembly steps with screws or adhesives. This integration ensures the bumper cannot detach while simplifying the overall assembly process.
2Ease of manufacture
If traditional manual manufacturing methods are used, then the board can be produced, but the production process takes several weeks and requires significant labor
Solution Approach 1:
The substrate is first molded with precise edge geometry in a controlled manufacturing process. This preliminary action creates a perfectly prepared base that receives the bumper material, enabling the subsequent overmolding to proceed quickly and efficiently without requiring manual preparation or finishing steps.
Solution Approach 2:
Manual manufacturing steps are replaced with automated injection molding and overmolding processes. The mechanical system of molds and injection equipment performs all forming operations, eliminating the need for manual cutting, sanding, and assembly operations that characterized traditional production methods.
3Loss of substance
If traditional manufacturing methods are used, then the board can be produced, but excessive material waste is generated from cutting and sanding operations
Solution Approach 1:
The manufacturing process transitions from subtractive operations (cutting and sanding) to additive operations (injection molding and overmolding). By changing the fundamental manufacturing parameter from removal to deposition of material, the process achieves precise edge geometry and bumper integration without generating the material waste inherent in traditional subtractive methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces production time and costs, minimizes material waste, and enhances the board's quality and performance by eliminating the need for separate assembly steps and additional finishing processes, while providing a durable and impact-resistant surface.
Implementation Method 1
the material comprises a thermoplastic or a thermosetting plastic. Thermoplastics are plastics that become moldable at a certain temperature and solidifies upon cooling
Implementation Method 2
bonding the resin to the first and second layers of fiber cloth by curing to form the substrate
Data Source
AI summary
The present invention relates to a method of manufacturing a board for sport equipment and the board for sport equipment thereof. The method comprises the steps of molding a substrate on a first mold; transferring the substrate to a second mold; and injecting a thermoplastic material into a cavity provided between at least a part of an edge side of the substrate and the second mold to form the board with a board bumper on the at least a part of the edge side of the substrate.