Board Card Heat Dissipation Device with Parallel Fin and Pipe Layout
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Solution Overview
Problem
Existing heat dissipation devices for board cards with high power consumption, such as those using ASIC and FPGA chips, have low heat dissipation efficiency due to the limitations of traditional heat dissipation fins, which fail to effectively manage the increased heat generated by these components.
Innovation Solution
A heat dissipation device comprising a fin group and a heat pipe group where the fins are arranged parallel to the heat pipes, allowing for self-localization and increased contact area, thereby enhancing heat transfer efficiency without the need for special locating fixtures, and including a metal heat dissipation plate for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional heat dissipation fins are used with thermal grease, then heat can be transferred to the fins, but heat dissipation efficiency remains low and cannot meet high power consumption requirements
Solution Approach 1:
The patent changes the fundamental heat transfer parameter from thermal conduction through grease to phase change heat transfer using heat pipes. The heat pipes utilize evaporation and condensation phase changes to achieve high-speed heat transport, transforming the heat transfer mechanism to overcome the low efficiency of traditional thermal grease-based systems
Solution Approach 2:
The heat pipes in the patent exploit phase transitions (evaporation and condensation) of the working fluid to achieve efficient heat transfer. The evaporating section absorbs heat through phase change from liquid to vapor, and the condensing section releases heat through phase change from vapor to liquid, enabling high heat dissipation efficiency that meets high power consumption requirements
2Device complexity
If heat pipes and radiation fins are arranged orthogonally, then structure is simplified, but radiation fins cannot be located between heat pipes and self-localization is impossible
Solution Approach 1:
The patent employs asymmetric design where heat dissipation fins are extended specifically at positions corresponding to heat pipes, creating an asymmetric structure that enables self-localization. This asymmetric fin extension allows the fins to naturally align with and contact the heat pipes during assembly, achieving precise positioning without additional locating fixtures while maintaining simplified orthogonal arrangement
Solution Approach 2:
The heat dissipation fins serve a dual function: they provide heat dissipation surface area and simultaneously act as self-localization features. The asymmetric extension of fins at heat pipe positions allows the assembly to self-align and self-localize during installation, eliminating the need for separate locating fixtures and reducing assembly complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher heat dissipation efficiency by allowing heat pipes to distribute heat rapidly to the fin group, which dissipates heat effectively into the air, while simplifying assembly by eliminating the need for locating fixtures and enhancing the contact area between heat dissipation fins and pipes.
Implementation Method 1
a heat pipe group including a plurality of heat pipe
Implementation Method 2
the heat emitted by the electronic element to be transferred effectively to the heat dissipation fins
Implementation Method 3
dispersed in the ambient air through the heat dissipation fins
Implementation Method 4
bottom radiation fins
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present disclosure provides a heat dissipation device and a board card. The heat dissipation device includes a fin group provided with a plurality of heat dissipation fins, and a heat pipe group provided with at least one heat pipe. The fin group is wholly located on one side of the heat pipe group in a first direction. The heat dissipation device and the board card have high heat dissipation efficiency.