A cooling device
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Solution Overview
Problem
The nonhomogeneous spreading of polyurethane insulation material during the manufacturing of cooling devices causes structural defects and deformation of the board casing, leading to increased costs and labor due to the need for additional support members.
Innovation Solution
Incorporating protrusions on the board casing that extend from the base to the ceiling with recesses to increase strength during insulation material application, which are later broken and removed to prevent deformation and facilitate easy circuit board placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If support members are placed between the board casing walls to prevent deformation during polyurethane injection, then the board casing strength is improved, but the manufacturing cost and labor requirements increase
Solution Approach 1:
The board casing is segmented by adding protrusions that divide the internal space into multiple regions. These protrusions are strategically positioned to provide structural support against polyurethane injection pressure without requiring external support members, thus preventing deformation while avoiding increased manufacturing complexity
Solution Approach 2:
The protrusions are nested within the board casing structure itself, extending from the inner wall toward the outer wall. This internal nesting provides reinforcement without adding external components, eliminating the need for separate support members and reducing both cost and labor requirements
2Manufacturing precision
If the board casing structure is modified to prevent deformation during insulation material application, then the manufacturing process is improved, but the circuit board placement flexibility is reduced
Solution Approach 1:
The protrusions are designed with varying dimensions and positions tailored to specific local requirements of the board casing. Each protrusion is optimized for its particular location to provide necessary support while maintaining overall flexibility for circuit board placement, thus achieving both manufacturing precision and adaptability
Solution Approach 2:
The protrusions are pre-positioned within the board casing during manufacturing to provide structural support during polyurethane injection. After the insulation material cures, the protrusions are removed, leaving the board casing with improved dimensional stability while maintaining flexibility for subsequent circuit board placement operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents board casing deformation during insulation material application, eliminating the need for design changes or additional support members, and allows for easy mounting of circuit boards without dimension limitations.
Implementation Method 1
an insulation material such as polyurethane is injected between the inner wall and the outer wall in liquid form while inside the mold, and then the polyurethane expands after a while due to its properties
Implementation Method 2
the insulation material continues to cool down. Due to the nonhomogeneous spreading of the insulation material in the insulation volume, different forces act on the inner wall and outer wall of the body, and structural defects occur in the inner and outer walls due to the irregular shrinkage of the insulation material
Data Source
Figure 1
AI summary
This invention helps to prevent any deformation of the walls of the board casing (2) by increasing the strength of the board casing (2) during the filling of the insulation material, thanks to the temporary protrusions (5) extending from the base (3) of the board casing (2) and after the insulation material is filled, the protrusions (5) are broken and removed from the board casing (2), allowing the desired electronic card to be easily placed inside the board casing (2), regardless of the dimensions of the electronic card to be placed in the board casing (2).