Board Clamping Device for Upward Warpage Correction
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Solution Overview
Problem
Existing board clamping apparatuses are unable to reliably correct upward warpage of boards during double-sided mounting, leading to reduced mounting accuracy and increased complexity and costs, as they often interfere with pre-mounted components and require complex configurations.
Innovation Solution
A board clamping apparatus that applies a downward bending moment to the board by clamping its lateral end portion between a lifting member and a holding member, allowing for reliable correction of upward warpage without interfering with pre-mounted components, while simplifying the configuration and reducing costs by using a movable holding member and a slope or protrusion on the holding member's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If suction pads are disposed below the board to correct upward warpage, then upward warpage correction is achieved, but the configuration becomes complex and costs increase
Solution Approach 1:
Instead of using suction pads below the board to correct upward warpage, the invention inverts the approach by using a protrusion on the holding member that contacts the upper surface of the board. This applies a downward bending moment through the clamping action between the lifting member and holding member, correcting upward warpage without requiring complex suction mechanisms below the board.
2Reliability
If suction pads are disposed below the board to correct upward warpage, then upward warpage correction is achieved, but pre-mounted components may interfere with the suction pads during mounting
Solution Approach 1:
The invention contacts the board from the upper surface through the protrusion on the holding member, rather than from below with suction pads. This inverted approach allows the warpage correction mechanism to operate without interfering with pre-mounted components on the lower surface of the board during double-sided mounting operations.
3Reliability
If a back-up pin is used to correct board warpage, then downward warpage is corrected, but upward warpage cannot be corrected
Solution Approach 1:
The invention uses a protrusion on the holding member that contacts the upper surface of the board, applying a downward bending moment through clamping. This inverted contact approach from the upper surface enables correction of upward warpage, complementing the back-up pin's capability to correct downward warpage from below.
Solution Approach 2:
The invention changes the contact parameter from below-board support (back-up pin) to above-board contact (protrusion on holding member). This parameter change in contact location and force direction enables the system to address upward warpage while maintaining compatibility with existing downward warpage correction capabilities.
4Device complexity
If the holding member is fixed in position, then clamping is simple, but upward warpage cannot be corrected without additional complex mechanisms
Solution Approach 1:
The holding member is made movable in the width direction between a normal clamping position and an upward warpage correction position. This dynamic positioning capability allows the same holding member to perform both normal clamping operations and upward warpage correction by adjusting its position, eliminating the need for separate fixed mechanisms for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively corrects upward warpage of boards during double-sided mounting without interfering with pre-mounted components, simplifying the configuration, and reducing costs by applying a downward bending moment through a clamping action, thereby improving mounting accuracy and reducing operational complexity.
Implementation Method 1
a lateral end portion of the board is clamped between a lifting member and a holding member positioned above the lifting member
Implementation Method 2
an upward warpage correction means for correcting upward warpage of the board by applying a downward bending moment to the board by clamping the lateral end portion of the board between the lifting member and the holding member
Data Source
Figure 1
Figure 2(a)~2(b)
Figure 3(a)~3(b)
AI summary
A holding member 22 that holds a lateral end portion of a board 13 is attached to be movable between an upward warping correction position and a normal clamping position with respect to a guide rail 14 of a conveyor 12. When the holding member 22 is positioned at the upward warpage correction position, a distal end portion that is the lowest portion of a slope surface 23 of the holding member 22 is positioned at an inner side of the board 13 than the upper end of the lifting member 21. By nipping the lateral end of the board 13 between the distal end portion of the slope surface 23 and the upper end of the lifting member 21 in such a positional relationship, the board 13 is clamped in a state that the downward bending moment is applied to the board 13. In the normal clamping position, the distal end portion of the slope surface 23 of the holding member 22 is positioned directly above the lifting member 21. By nipping the lateral end portion of the board 13 between the distal end portion of the slope surface 23 and the upper end of the lifting member 21 in such a positional relationship, the board 13 is clamped in a state that the downward bending moment is not applied to the board 13.