Board Connector Fixing Member Plate Pieces Pre-Plating

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Solution Overview

Problem

Existing board connectors face challenges in achieving good solder wettability when pre-plating is performed, as plating layers cannot be formed on the end surfaces of the fixing member, leading to poor solder adhesion and increased post-plating costs.

Innovation Solution

A board connector design featuring a substantially plate-like fixing member with plate pieces arranged to face each other in the plate thickness direction, where plating layers are formed on the plate surfaces and continuous plating drip layers are formed on the end surfaces, enhancing solder adhesion and wettability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If pre-plating is performed on the metal plate before punching out, then material cost is reduced and manufacturing efficiency is improved, but solder wettability deteriorates because plating layers cannot be formed on the end surfaces of the fixing member

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidsolder wettability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The board fixing portion is segmented into multiple plate pieces (first plate piece and second plate piece) that face each other in the plate thickness direction. This segmentation allows plating layers to be formed on the plate surfaces of each piece, and plating drip layers to be formed on their respective end surfaces, ensuring good solder wettability even with pre-plating.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from a single-plane plate structure to a multi-dimensional structure where plate pieces are arranged facing each other in the plate thickness direction. This dimensional change creates multiple plate surfaces and end surfaces that can all be plated, resolving the contradiction between pre-plating efficiency and solder wettability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If post-plating is performed after punching out to improve solder wettability, then solder adhesion is improved, but manufacturing cost increases

Engineering Contradiction:

Improvesolder adhesionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The invention performs plating on the metal plate before punching out (pre-plating), but through the innovative plate piece configuration, achieves solder wettability comparable to post-plating. The plating layers on plate surfaces and plating drip layers on end surfaces are formed in advance, eliminating the need for costly post-plating operations.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If plate pieces are arranged facing each other in the plate thickness direction with plating layers on plate surfaces and plating drip layers on end surfaces, then solder wettability is improved, but device complexity increases

Engineering Contradiction:

Improvesolder wettabilityVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The plate pieces serve multiple functions: they provide structural support for mounting, create multiple plate surfaces for plating layer formation, and provide end surfaces for plating drip layer formation. This multi-functionality achieves improved solder wettability without proportionally increasing structural complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The plating layers and plating drip layers are applied locally to specific surfaces of the plate pieces - plating layers on plate surfaces and plating drip layers on end surfaces. This localized plating approach improves solder wettability where needed without requiring complex plating processes throughout the entire structure.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves solder wettability, reduces material costs, and simplifies manufacturing by allowing pre-plating of the metal plate before punching, resulting in a stronger holding force on the circuit board.

Implementation Method 1

plating layers are formed on plate surfaces of the plate pieces

Methodology Applied

Scientific EffectPlating: Electroplating

Implementation Method 2

plating drip layers substantially continuous with the plating layers are formed on end surfaces of the plate pieces

Methodology Applied

Scientific EffectPlating drip formation: Deposition (physical)

Implementation Method 3

Solder adheres to the plating layers formed on both plate surfaces of the plate pieces so that solder wettability is improved

Methodology Applied

Scientific EffectSoldering: Soldering

Data Source

PatentUS9774116B2Board connector having a fixing member with plate pieces facing each other in a plate thickness direction

Publication Date: 2017.09.26 SUMITOMO WIRING SYSTEMS LTD

AI summary

A board connector includes a plate-like fixing member (30) to be mounted in a housing (10) and including a board fixing portion (31) to be fixed to a circuit board (100) by solder. At least the board fixing portion (31) of the fixing member includes a plurality of plate pieces (38A, 38B) arranged to face each other in a plate thickness direction. Plating layers (46) are formed on plate surfaces of the plate pieces (38A, 38B) and plating drip layers (43) continuous with the plating layers (46) are formed on end surfaces of the plate pieces (38A, 38B) intersecting with the plate surfaces.