Board-to-Board Connector Layout to Suppress Path Resonance
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Solution Overview
Problem
The alignment member in existing connector devices, made of metal, can cause resonance with board transmission paths, leading to reduced communication performance due to its overlapping size and conductive properties.
Innovation Solution
A connector device design where the electrically conductive member is positioned within an inclusion region on a virtual projection plane, separated from the board transmission paths, and an electrically nonconductive alignment member holds the adapters, ensuring minimal conductive member size and preventing resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the alignment member is made of metal and has a large size extending over a wide range, then it can effectively hold the outer conductors at the same potential, but resonance occurs between the board transmission paths and the alignment member, reducing communication performance
Solution Approach 1:
The alignment member is divided into multiple separate conductive members, each corresponding to individual outer conductors or groups of outer conductors. This segmentation prevents the formation of a large continuous conductive structure that could resonate with board transmission paths, while still maintaining potential equality through localized connections.
Solution Approach 2:
The conductive function is extracted from the alignment member and implemented through separate conductive members that are selectively positioned. This allows the alignment member to focus on mechanical alignment and positioning functions, while the conductive members handle the electrical potential equalization, avoiding the resonance issue caused by a large metal alignment member.
2Adaptability or versatility
If the alignment member is made of metal and extends over a wide range, then it can hold multiple adapters, but it overlaps with board transmission paths on the virtual projection plane, causing resonance
Solution Approach 1:
The alignment member is divided into multiple separate conductive members, each corresponding to individual outer conductors or groups of outer conductors. This segmentation prevents the formation of a large continuous conductive structure that could resonate with board transmission paths, while still maintaining potential equality through localized connections.
Solution Approach 2:
Conductive properties are applied locally at specific positions where outer conductors need potential equalization, rather than making the entire alignment member conductive. This localized approach minimizes the conductive material presence on the projection plane, avoiding resonance while maintaining necessary electrical connections.
3Object-affected harmful factors
If the electrically conductive member is made minimal in size, then resonance is suppressed, but it may have difficulty making multiple outer conductors conductive
Solution Approach 1:
Multiple small conductive members are combined through the alignment member structure to achieve the function of a large conductive member. Each small conductive member connects to specific outer conductors, and their combined effect through the alignment member achieves potential equalization across multiple outer conductors without causing resonance.
Solution Approach 2:
The alignment member acts as an intermediary that connects multiple small conductive members to the outer conductors. This intermediary structure enables the small conductive members to collectively influence multiple outer conductors' potentials without requiring any single conductive member to be large, thus avoiding resonance while maintaining conductive reliability.
Data Source
AI summary
A connector device (A) is provided with a pair of circuit boards (11, 21) including board transmission paths (13, 23) and arranged to face each other, a pair of connectors (14, 24) to be mounted on the pair of circuit boards (11, 21), a plurality of adapters (60) including relay outer conductors (63) and configured to connect the pair of connectors (14, 24), and an electrically conductive member (40) made of metal to make a plurality of the relay outer conductors (63) conductive. The board transmission paths (13, 23) are arranged outside an inclusion region (R) including the plurality of adapters (60) on a virtual projection plane (S) parallel to the circuit boards (11, 21). The electrically conductive member (40) is arranged only within the inclusion region (R) on the virtual projection plane (S).