Board-to-Board Connector Signal Integrity via Shielding
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Solution Overview
Problem
Existing board-to-board connectors face challenges in achieving higher speed capabilities while maintaining signal integrity and reducing noise, particularly in transmitting differential signals at higher frequencies and densities.
Innovation Solution
The electrical connector features signal leads and ground leads arranged in an alternating pattern, with ground leads wide enough to shield signal leads, and mating and mounting contacts organized in distinct patterns to minimize noise, ensuring proper alignment and impedance for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If signal density and throughput are increased to achieve higher data rates, then productivity and speed capability are improved, but noise and crosstalk increase causing signal integrity degradation
Solution Approach 1:
The patent applies local quality by making ground leads adjacent to signal leads wider than standard ground leads, creating localized enhanced shielding zones where noise is most problematic. This selective variation in ground lead dimensions provides targeted noise protection without increasing the overall connector size, thereby maintaining high signal density while reducing crosstalk between adjacent differential pairs.
2Reliability
If ground leads are made wider to improve shielding and reduce noise, then signal integrity is improved, but the connector size and complexity increase
Solution Approach 1:
The invention implements local quality by varying the width of ground leads only in specific positions where they are adjacent to signal leads, while other ground leads maintain standard dimensions. This selective approach provides enhanced shielding precisely where crosstalk occurs without proportionally increasing the overall connector complexity or size.
Solution Approach 2:
The patent addresses shielding requirements by transitioning from a two-dimensional contact pattern to a three-dimensional arrangement where ground leads are positioned between signal leads in the thickness direction. This vertical stacking approach reduces horizontal space requirements and manages complexity by utilizing the Z-axis for noise protection.
3Object-affected harmful factors
If signal leads are arranged in alternating pattern with ground leads to reduce crosstalk, then noise reduction is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies segmentation by dividing the connector into repeating units, each containing a standardized arrangement of signal and ground leads. This modular structure with alternating patterns simplifies manufacturing by allowing repetitive production of identical segments, thereby reducing the cumulative effect of precision errors while maintaining effective crosstalk reduction.
4Reliability
If contact patterns are offset between adjacent contact modules to minimize noise, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The invention implements asymmetry by offsetting the contact patterns of adjacent contact modules relative to each other. This asymmetric arrangement breaks the symmetry that would otherwise create consistent coupling paths for noise between modules, thereby reducing inter-module crosstalk while maintaining a relatively simple overall structure through the repetition of offset patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the connector's speed capability, reduces noise, and maintains signal integrity by effectively shielding differential signals and minimizing crosstalk, thereby achieving higher throughput with reduced signal loss.
Implementation Method 1
each of said ground leads having a width sufficient to shield a pair of said signal leads from an adjacent pair of said signal leads within the same contact module
Data Source
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AI summary
An electrical connector comprises a housing (130) defining a connector mating interface (172), and the housing holds a plurality of contact modules (190) that cooperate to define a connector mounting interface (174). Each said contact module contains signal leads (220) and ground leads (222) arranged in an alternating pattern of individual said ground leads and pairs (240) of said signal leads positioned side-by-side with respect to a thickness of said contact module. The signal and ground leads have respective mating contacts (210) proximate the mating interface and respective mounting contacts (204) proximate the mounting interface. The mating and mounting contacts of each said contact module are arranged in one of first and second contact patterns different from the pattern of said signal and ground leads within said contact module, and the mating and mounting contacts of adjacent said contact modules are arranged in respective different ones of said first and second contact patterns.