Board Distribution Control for Mixed Workload Mounting Lines

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Solution Overview

Problem

Existing electronic component mounting systems face inefficiencies when producing two kinds of boards with different mounting workloads concurrently, leading to uneven working tact times and imbalanced production line efficiency.

Innovation Solution

An electronic component mounting system with a component mounting line formed by interconnected units, including first and second board conveyance mechanisms, a distribution control unit that mixesly distributes boards based on a board request signal from the most-upstream unit, ensuring balanced workload distribution and efficient production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If boards with different mounting workloads are conveyed by separate board conveyance mechanisms, then concurrent production of multiple board types is enabled, but difference in working tact time occurs among conveyance mechanisms

Engineering Contradiction:
Improveconcurrent production capabilityVSAvoidworking tact time difference
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent merges multiple board conveyance mechanisms into a single shared conveyance system that serves all component mounting units. This allows boards with different mounting workloads to be conveyed through the same mechanism, eliminating the tact time difference that occurs when separate mechanisms are used. The shared conveyance mechanism synchronizes board delivery across all units, resolving the contradiction between concurrent production capability and working tact time consistency.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The board conveyance mechanism is designed to be universal, serving multiple component mounting units that process different board types. This multi-functional conveyance system can handle various board configurations and deliver them to different units according to production needs, enabling concurrent production while maintaining synchronized tact times through centralized control.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If separate board conveyance mechanisms are used for different board types, then board specific processing is optimized, but line balance cannot be maintained

Engineering Contradiction:
Improveboard specific processing efficiencyVSAvoidline balance
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The control system implements feedback mechanisms that monitor the status of each component mounting unit and dynamically adjust board distribution. Based on real-time information about unit readiness and workload, the control system directs boards to appropriate units through the shared conveyance mechanism, optimizing processing efficiency while maintaining line balance through continuous adjustment.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system transitions from static, dedicated conveyance mechanisms to a dynamic, shared conveyance system that can adapt its operation in real-time. The control system dynamically assigns boards to different mounting units based on current production needs, allowing the system to optimize for both board-specific processing efficiency and overall line balance simultaneously.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10863657B2Electronic component mounting method
Publication Date: 2020.12.08 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US10863657B2 patent drawing
  • US10863657B2 patent drawing
  • US10863657B2 patent drawing

AI summary

An electronic component mounting method is performed by an electronic component mounting system including a component mounting line formed by interconnecting component mounting units which concurrently performs component mounting work on two kinds of boards different in mounting workload. The component mounting units includes: first and second board conveyance mechanisms; a component mounting unit; a board distribution unit which receives the board from the upstream-side apparatus and distributes the received board to either the first board conveyance mechanism or the second board conveyance mechanism; and a distribution control unit which controls the first board conveyance mechanism, the second board conveyance mechanism and the board distribution unit. The electronic component mounting method comprises mixedly distributing the two kinds of the boards to each of the first and second board conveyance mechanisms based on a board request signal issued from a most-upstream component mounting unit in the component mounting line.