Board for Electronic Component Package With Electrical Testing Wiring
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Solution Overview
Problem
Existing electronic component packaging technologies face challenges in efficiently performing electrical tests before component mounting, particularly due to the complexity of applying signals to both upper and lower portions of the wiring part during manufacturing, which can lead to unnecessary component consumption and defects.
Innovation Solution
The implementation of a wiring part with insulating layers, signal transferring wiring, and electrical testing wiring, where the electrical testing wiring is disconnected from the signal transferring wiring, allowing for electrical testing through the upper surface before component mounting, using conductive patterns and vias to facilitate testing without connecting to the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical testing wiring is connected to signal transferring wiring for testing, then electrical test can be performed, but electronic component cannot be electrically disconnected during testing
Solution Approach 1:
The wiring structure is segmented into two independent parts: signal transferring wiring for component connection and electrical testing wiring for testing purposes. This segmentation allows the testing wiring to be electrically disconnected from the signal transferring wiring, enabling independent testing without affecting the electronic component connection.
Solution Approach 2:
A separate electrical testing wiring acts as an intermediary pathway that enables electrical testing without requiring connection to the signal transferring wiring. This intermediary structure facilitates testing while maintaining independence from the signal transmission path.
2Loss of substance
If electrical test is performed after electronic component mounting, then component consumption is reduced, but manufacturing efficiency decreases due to rework requirements
Solution Approach 1:
Electrical testing is performed as a preliminary action before electronic component mounting. The separate electrical testing wiring enables testing of the wiring part itself without requiring component installation, allowing defects to be identified and corrected early in the manufacturing process before components are consumed.
3Device complexity
If signal transferring wiring and electrical testing wiring are integrated, then device complexity is reduced, but electrical disconnection for testing becomes difficult
Solution Approach 1:
The wiring system is divided into distinct signal transferring wiring and electrical testing wiring pathways. This segmentation provides clear electrical disconnection between the two functions, making it easy to isolate the testing wiring from the signal transferring wiring during the manufacturing process.
Data Source
AI summary
A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.