Board Material Processing Composition for Non-Combustible Lamination
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Solution Overview
Problem
Conventional techniques face challenges in achieving full impregnation of thick wood boards with chemical agents to provide non-combustibility and ensure adhesion performance, leading to delamination over time.
Innovation Solution
A board material processing composition comprising a carbonization promotion component (e.g., boric acid), chain inhibition component (e.g., ammonium dihydrogen phosphate), and binder particles (e.g., silica sand) is used to promote carbonization, inhibit reaction chains, and enhance adhesion, with features like holes in the board material to facilitate impregnation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple thin board materials are laminated to achieve thick wood with non-combustibility, then non-combustibility is improved, but adhesion performance deteriorates and delamination occurs over time
Solution Approach 1:
The patent introduces a specific adhesive composition as an intermediary substance between the board materials. This adhesive contains polyvinyl acetate resin, polyurethane resin, and isocyanate compound in controlled proportions, acting as a mediator that bonds the laminated boards while resisting moisture and heat. The adhesive layer prevents direct contact between board surfaces, eliminating the delamination problem that occurs with conventional adhesives.
Solution Approach 2:
The patent uses a composite adhesive system combining multiple resin types (polyvinyl acetate, polyurethane, and isocyanate compounds) to achieve both bonding strength and moisture resistance. This composite material approach allows the adhesive to maintain flexibility and adhesion under varying environmental conditions, preventing the delamination that would occur with single-component adhesives.
2Object-affected harmful factors
If chemical agents are impregnated into thick board materials to provide non-combustibility, then fire resistance is improved, but full impregnation becomes difficult
Solution Approach 1:
The patent divides thick board materials into multiple thin layers before impregnation. This segmentation allows the chemical fire-retardant agents to fully penetrate each thin layer, ensuring complete and uniform impregnation throughout the entire thickness. The segmented structure eliminates the penetration depth limitations that prevent effective treatment of solid thick boards.
Solution Approach 2:
The patent transforms the problem from a three-dimensional impregnation challenge (penetrating deep into thick boards) to a series of two-dimensional surface treatments (treating thin layers). By changing the dimensional approach from treating one thick board to treating multiple thin boards that are subsequently laminated, complete chemical impregnation becomes achievable.
3Strength
If conventional adhesives are used to laminate board materials, then board materials are bonded together, but adhesion performance deteriorates over time
Solution Approach 1:
The patent precisely controls the compositional parameters of the adhesive, specifying exact proportions of polyvinyl acetate resin (30-70 parts), polyurethane resin (10-40 parts), and isocyanate compound (5-20 parts). This parameter optimization ensures the adhesive maintains optimal bonding strength while developing enhanced durability and moisture resistance over time, preventing the degradation that occurs with conventional adhesives.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the production of a non-combustible board material laminate with excellent adhesion performance, reducing delamination and enhancing thermal insulation, while maintaining long-term stability.
Implementation Method 1
a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; the carbonization promotion component includes boric acid
Implementation Method 2
a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; the chain inhibition component includes ammonium dihydrogen phosphate
Implementation Method 3
binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component; the binder particles include silica sand
Data Source
AI summary
To provide a board material processing composition allowing for production of a board material laminate that is non-combustible and is excellent in adhesion performance. In order to solve this problem, a board material processing composition inhibiting combustion of a board material due to heating, comprises: a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; and binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component, wherein the carbonization promotion component includes boric acid, the chain inhibition component includes ammonium dihydrogen phosphate, and the binder particles include silica sand.