Circuit Board Assembly Layout for Cable Reduction and Cooling
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Solution Overview
Problem
The increasing layout density of components on circuit boards poses a significant challenge for effective heat dissipation, particularly in high-data transmission networks like optical transport networks and cloud data centers, where high device density and large data processing generate substantial heat.
Innovation Solution
The implementation of a circuit board assembly that segregates low-speed and high-speed signals onto separate channels, utilizing a monitoring module to combine low-speed signals and reduce the number of cables between circuit boards, while positioning high-speed connectors within the projection area of a chip heat sink to minimize space occupation and enhance airflow ventilation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the layout density of components on circuit boards is increased, then the device integration is improved, but the heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the circuit board into multiple layers, with active components concentrated on one side and passive components on the other side. This segmentation allows heat-generating components to be isolated from heat-sensitive areas, improving heat dissipation while maintaining high integration density.
Solution Approach 2:
The patent utilizes the vertical dimension by implementing multi-layer board design. Components are distributed across different layers (first circuit board layer, second circuit board layer), effectively using three-dimensional space to achieve high integration without increasing planar density, thereby maintaining adequate heat dissipation pathways.
2Productivity
If the number of cables connecting circuit boards is increased, then the signal transmission capability is improved, but the space occupation increases and heat dissipation is hindered
Solution Approach 1:
The patent combines multiple signal transmission functions into integrated connector designs. The connectors are configured to handle multiple signals simultaneously through standardized interfaces, reducing the total number of separate cables needed while maintaining comprehensive signal transmission capability.
Solution Approach 2:
The patent implements universal connector designs that can handle multiple signal types (high-speed signals, low-speed signals, power signals) through a single integrated interface. This multi-functionality reduces cable quantity while preserving full signal transmission capabilities across different board layers and devices.
3Reliability
If connectors are positioned outside the heat sink projection area, then the signal transmission is optimized, but the surface utilization is reduced and heat dissipation space is limited
Solution Approach 1:
The patent positions connectors within the projection area of heat sinks, effectively nesting the connector structures inside or alongside the heat dissipation components. This nested arrangement allows connectors to occupy the same vertical space as heat sinks, maximizing surface utilization without compromising signal transmission, as the heat sink structure provides both thermal management and mechanical support for the connectors.
Data Source
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AI summary
Embodiments of this application disclose a circuit board assembly, and are applied to the field of electronic communications technologies, to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on the second circuit board, low-speed signals transmitted between a plurality of I/O (input/output, input/output) modules and an IC (integrated circuit, integrated circuit) chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. Therefore, there are a relatively small quantity of low-speed cables, to help airflow ventilation, so that a prior-art heat dissipation problem of a circuit board can be resolved. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.