Board Level Shields With Virtual Grounding Using L-C Resonators
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Solution Overview
Problem
Conventional board level shields require physical grounding via or grounding pins to connect to a ground plane, occupying valuable PCB space and complicating the design process, while also limiting the shielding effectiveness in specific frequency ranges.
Innovation Solution
The implementation of board level shields with virtual grounding capability using L-C resonators that resonate at specific frequencies, allowing for virtual connection to a ground plane without physical electrical connections, thereby eliminating the need for grounding vias and reducing PCB space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional board level shields use physical grounding via grounding vias or grounding pins, then the shielding effectiveness is improved, but the PCB space occupation increases and design complexity increases
Solution Approach 1:
The patent extracts and eliminates the physical grounding mechanisms (grounding vias and grounding pins) from the shield structure. By removing these unnecessary components, the design achieves virtual grounding through the inherent capacitance between the shield and ground plane, thereby freeing up PCB space while maintaining shielding effectiveness through the capacitive coupling mechanism.
Solution Approach 2:
The patent introduces an intermediary capacitive coupling mechanism between the shield and ground plane. Instead of direct physical connection, the shield is coupled to ground through distributed capacitance formed by the proximity of the shield to the ground plane, separated by a dielectric layer. This intermediary capacitive path provides the necessary reference potential without requiring physical grounding vias or pins.
2Reliability
If conventional board level shields use physical grounding mechanisms, then the shielding effectiveness is improved, but the device complexity and manufacturing complexity increase
Solution Approach 1:
The patent removes the complex physical grounding infrastructure (grounding vias, grounding pins, and associated soldering requirements) from the shield design. By extracting these components, the design complexity is significantly reduced while the shielding effectiveness is maintained through the simpler virtual grounding approach using capacitive coupling.
Solution Approach 2:
The shield structure serves its own grounding function through the inherent capacitance between the shield and ground plane. The distributed capacitance formed by the proximity of the shield to the ground plane provides the necessary reference potential, eliminating the need for separate grounding mechanisms and their associated complexity.
3Area of stationary object
If board level shields eliminate physical grounding mechanisms, then the PCB space is freed up and design is simplified, but the shielding effectiveness in specific frequency ranges may be limited
Solution Approach 1:
The patent changes the grounding parameter from direct physical connection to capacitive coupling. By adjusting the distance between the shield and ground plane, and the dielectric properties of the separating layer, the capacitive coupling strength can be optimized to provide effective virtual grounding across specific frequency ranges, maintaining shielding effectiveness while freeing PCB space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides high shielding effectiveness up to 40 decibels in narrow frequency bands without physical grounding mechanisms, freeing up approximately 50% of PCB space, reducing costs, and simplifying the design by eliminating the need for grounding vias and soldering procedures.
Implementation Method 1
L-C resonators that resonate at specific frequencies, allowing for virtual connection to a ground plane without physical electrical connections
Data Source
AI summary
According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.