Board Processing Composition for Fire Resistance and Adhesion
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Solution Overview
Problem
Conventional techniques face challenges in achieving full impregnation of thick wood boards with chemical agents to provide non-combustibility and ensure adequate adhesion performance, leading to delamination over time.
Innovation Solution
A board material processing composition comprising a carbonization promotion component (e.g., boric acid), a chain inhibition component (e.g., ammonium dihydrogen phosphate), and binder particles (e.g., silica sand) is used to promote carbonization, inhibit reaction chains, and enhance adhesion, respectively, with the addition of ceramic particles for thermal insulation and improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If multiple thin board materials are laminated to produce thick wood, then the non-combustibility is improved, but the adhesion performance deteriorates and delamination occurs over time
Solution Approach 1:
The patent combines multiple functions into a single adhesive composition: fire-retardant chemicals (ammonium phosphate, boric acid, aluminum sulfate) are integrated with adhesive agents (casein, starch, or synthetic resins) to create a dual-function material that simultaneously provides bonding strength and combustion resistance, eliminating the need for separate adhesive and fire-retardant treatment steps
Solution Approach 2:
The adhesive composition uses composite material systems combining organic adhesive bases (casein, starch, or synthetic resins) with inorganic fire-retardant salts (ammonium phosphate, boric acid, aluminum sulfate) to achieve both adhesion and fire resistance properties in a single material system
2Object-affected harmful factors
If chemical agents are impregnated into thick board materials, then non-combustibility is improved, but full impregnation becomes difficult
Solution Approach 1:
The patent specifies optimized concentration ranges for fire-retardant chemicals (ammonium phosphate: 5-50 parts by mass per 100 parts adhesive, boric acid: 5-30 parts, aluminum sulfate: 10-50 parts) to ensure sufficient fire resistance while maintaining proper impregnation and avoiding excessive viscosity that would hinder penetration into thick board materials
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the production of a non-combustible board material laminate with enhanced adhesion performance and thermal insulation, reducing the risk of delamination and improving fire resistance.
Implementation Method 1
a carbonization promotion component, being inorganic, promoting carbonization of an organic component within the board material at the heating; the carbonization promotion component includes boric acid
Implementation Method 2
a chain inhibition component, being inorganic, inhibiting a reaction chain to a neighboring component due to a product of endothermic decomposition generated at the heating; the chain inhibition component includes ammonium dihydrogen phosphate
Implementation Method 3
binder particles, being inorganic and hydrophobic, bonding the organic component within the board material to the carbonization promotion component and the chain inhibition component; the binder particles include silica sand
Data Source
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Figure 3
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AI summary
Provided is a board material processing composition enabling manufacture of a board material laminate which is noncombustible and superior in adhesive performance. In order to solve this problem, a board material processing composition that inhibits combustion of a board material due to heating contains: an inorganic carbonization promotion component that promotes carbonization of an organic component in the board material during the heating; an inorganic chain inhibition component that inhibits a reaction chain to adjacent components due to a product of endothermic decomposition generated during the heating; and inorganic hydrophobic binder particles that adhere the organic component in the board material with the carbonization promotion component and the chain inhibition component.