Board Module Connector With Through-Hole Housing for Heat Dissipation
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Solution Overview
Problem
Existing connector structures for board connections lack effective heat dissipation performance and are not optimized for downsizing.
Innovation Solution
A board module design featuring a connector housing within a through hole in the board, with a terminal including a heat dissipation portion exposed on the opposite side, allowing for improved heat dissipation and reduced structural size by integrating a heat dissipation promotion member and a stress absorption portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional connector structure is used for board connections, then the connection structure can be simple, but the heat dissipation performance is insufficient
Solution Approach 1:
The patent combines the connector housing with the heat dissipation function by integrating a heat dissipation member within the housing structure. The housing serves dual purposes: mechanical support for the terminal and heat dissipation pathway. This merging of functions improves heat dissipation performance while avoiding significant increases in structural complexity.
Solution Approach 2:
The connector housing is designed to perform multiple functions simultaneously: providing mechanical support for the terminal, enabling electrical connection, and facilitating heat dissipation. The heat dissipation member integrated into the housing structure allows the same component to serve both structural and thermal management roles, reducing the need for separate heat dissipation components.
2Temperature
If the connector structure is enlarged to improve heat dissipation, then heat dissipation performance improves, but the overall size of the connection structure increases
Solution Approach 1:
The heat dissipation member is nested within the connector housing structure, utilizing the existing housing volume for dual purposes. This nesting approach allows heat dissipation functionality to be added without proportionally increasing the overall connector size, as the heat dissipation features are integrated into the existing structural envelope rather than adding external bulk.
Solution Approach 2:
The patent employs heat dissipation features that extend in directions other than the primary connection axis, utilizing three-dimensional space efficiently. By creating heat dissipation pathways and structures in multiple dimensions within the housing, the design achieves effective thermal management without linearly increasing the connector's footprint or length.
3Temperature
If a through hole is formed in the board for connector housing, then heat dissipation is improved, but the board structure becomes more complex
Solution Approach 1:
The board structure is segmented to include a dedicated through-hole region that accommodates the connector housing and heat dissipation member. This segmentation isolates the heat dissipation functionality to a specific location, allowing the rest of the board structure to remain relatively simple while providing targeted thermal management where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance while minimizing the connector's size, maintaining electrical and mechanical connections effectively, and reducing the overall size and cost of the electrical junction box.
Implementation Method 1
a heat dissipation portion provided between the first board-side end portion and the first terminal portion and exposed from the connector housing
Data Source
AI summary
An object is to improve heat dissipation performance while reducing a distance between boards when circuits on the boards are electrically connected to each other. The board module includes a first board including a first circuit, and a first connector provided on the first board, and the first connector is connected to a second connector, a through hole is formed in the first board, the first connector includes a connector housing disposed in the through hole and a first terminal, the first terminal includes a first board-side end portion connected to the first circuit, a first terminal portion held by the connector housing, and a heat dissipation portion provided between a first board-side end portion and the first terminal portion and exposed as seen from the opposite side to the second connector with respect to the connector housing.