Board-Shaped Heat Dissipating Device With Embedded Heat Pipes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional board-shaped heat dissipating devices face challenges with poor heat dissipation efficiency and thermal resistance due to limited internal space and inaccuracies in assembling heat pipes, which affect the cooling ability of electronic devices.
Innovation Solution
A board-shaped heat dissipating device with a recessed board body and heat conducting elements, featuring grooves for embedding heat pipes with a bonding medium, ensuring tight attachment and reduced thermal resistance through precise welding and surface flattening to minimize space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling units with heat sinks and radiating fins are provided on electronic elements, then heat dissipation capability is improved, but device space occupation increases and cooling units become crowded
Solution Approach 1:
The patent merges the heat dissipation function into the motherboard structure by forming grooves directly on the board surface and embedding heat pipes within the board body. This integration eliminates the need for separate heat sink and radiating fin assemblies, achieving effective heat dissipation while minimizing space occupation.
Solution Approach 2:
The heat pipes are nested within the board body structure, with grooves formed on the board surface to receive and secure the heat pipes. This nesting approach allows the heat dissipation components to be contained within the existing device footprint, avoiding additional space requirements.
2Ease of operation
If heat pipes are embedded in grooves with large allowance for easy positioning, then assembling ease is improved, but thermal resistance increases due to clearance
Solution Approach 1:
The patent introduces a bonding agent as an intermediary substance filled into the grooves to secure the heat pipes. This bonding agent eliminates thermal resistance caused by clearance while still allowing for practical assembly, as the agent fills the gap and creates a thermal conduit between the heat pipe and board structure.
Solution Approach 2:
The patent changes the physical state and properties of the bonding material to optimize thermal conduction. By selecting a bonding agent with high thermal conductivity and filling it into the groove, the system transforms the gap from a thermal barrier into a thermal conduit, maintaining both assembly ease and heat dissipation efficiency.
3Manufacturing precision
If heat pipes are welded to grooves, then assembling accuracy is improved, but thermal resistance increases due to heated surface expansion
Solution Approach 1:
The patent changes the thermal and mechanical parameters of the groove structure by forming recesses with specific depth and cross-sectional dimensions. These parameter adjustments accommodate the thermal expansion of welded heat pipes while maintaining precise positioning and optimal thermal contact, thereby preserving both assembling accuracy and heat dissipation efficiency.
4Temperature
If conventional heat dissipating boards are used, then heat dissipation function is provided, but thermal resistance and poor assembling accuracy occur
Solution Approach 1:
The patent applies local quality enhancement by forming grooves with specific geometric characteristics (depth, width, cross-sectional shape) at the heat pipe embedding locations. This localized structural optimization ensures optimal thermal contact and minimizes thermal resistance at the critical heat transfer interfaces, while the rest of the board maintains its standard structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves enhanced heat dissipation efficiency while reducing thermal resistance and space usage, ensuring accurate assembly and improved cooling performance.
Implementation Method 1
heat pipes are embedded in one face of a heat dissipating board to thereby form a heat dissipating element... The heat pipe transfers the heat source to a relatively cold location on the heat dissipating board
Implementation Method 2
applying a heat-conducting bonding medium in the formed groove... presses the at least one heat pipe against the board body or the heat conducting element
Data Source
AI summary
A board-shaped heat dissipating device includes a board body having a plane face with a recess formed thereon, a heat conducting element fitted in the recess, at least one groove formed on any one of the board body and the heat conducting element, and at least one heat pipe pressed into the groove to flush with an open side of the groove. After the heat pipe is pressed into the groove and the heat conducting element is firmly fitted in the recess, portions of the heat conducting element that are higher than the plane face are removed through a cut operation, so that the heat conducting element is flush with the plane face of the board body to reduce the space occupied by the heat dissipating device. With the above arrangements, the problem of thermal resistance can be avoided and upgraded overall heat dissipation efficiency can be achieved.