Board Level Shield With Thermal Bridge Opening
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Solution Overview
Problem
Communication systems face challenges in providing effective electrical shielding and heat dissipation for electrical components, as existing shields often inadequately address the increasing electromagnetic interference (EMI) and heat generation issues due to rising data communication speeds.
Innovation Solution
A board-level shield with shield walls forming a chamber around electrical components, combined with a thermal bridge that extends through a shield opening to interface with the component, providing 360° electrical shielding and efficient heat dissipation by connecting to a heat transfer device for airflow or liquid cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shields are used to provide electrical shielding for electrical components, then electromagnetic interference is reduced, but heat dissipation becomes insufficient
Solution Approach 1:
The shield is segmented by introducing openings in the shield walls, dividing the continuous shield structure into sections that allow thermal airflow passage while maintaining electromagnetic shielding through strategic positioning and sizing of the openings
Solution Approach 2:
Different regions of the shield serve different functions: closed shield walls provide electromagnetic shielding in areas where heat generation is lower, while openings are strategically placed in regions where heat dissipation is critical, creating local variations in shielding density to balance EMI protection and thermal management
2Object-affected harmful factors
If shields provide complete enclosure for electrical shielding, then EMI protection is maximized, but airflow for heat dissipation is blocked
Solution Approach 1:
The complete enclosure is segmented by creating openings in the shield walls, breaking the continuous barrier into sections that permit thermal airflow while maintaining electromagnetic shielding effectiveness through the strategic design of opening locations and dimensions
Solution Approach 2:
The openings act as intermediaries that allow thermal energy (heat) to pass through the shield structure, mediating between the need for complete EMI protection and the requirement for heat dissipation by providing controlled pathways for airflow
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI and enhances heat dissipation, ensuring reliable performance of electrical components by providing comprehensive electrical shielding and thermal management, even as data communication speeds increase.
Implementation Method 1
a thermal bridge having an upper surface and a lower surface. The lower surface has a lower thermal interface configured to be thermally coupled to an electrical component to dissipate heat from the electrical component
Implementation Method 2
The thermal bridge extends through the shield opening to interface with the electrical component... configured to receive airflow to dissipate heat from the electrical component
Data Source
AI summary
A board level shield includes shield walls forming a shield chamber sized and shaped to receive an electrical component mounted to a host circuit board. The shield walls provide electrical shielding entirely around the shield chamber for the electrical component. The shield walls extend between a top and a bottom configured to be mounted to the host circuit board and connected to a ground layer of the host circuit board. The board level shield includes a shield opening at the top bounded by the shield walls and sized and shaped to receive a thermal bridge to allow the thermal bridge to extend through the shield opening to interface with the electrical component. The board level shield includes shield fingers extending from the shield walls into the shield opening. The shield fingers are configured to engage the thermal bridge at separable mating interfaces to electrically connect the shield fingers to the thermal bridge.