Board Unit With Hole-Inserted Terminals for Thin Memory Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing portable semiconductor storage devices face challenges in minimizing thickness while maintaining reliable electrical connections between the board and electronic components, which affects the overall compactness of the memory system and electronic devices.
Innovation Solution
The implementation of a board unit with a connection portion that includes electroconductive pads and terminals with extension portions inserted into holes on the board, utilizing a connection structure with electroconductive materials like solder or paste to ensure stable electrical connections, allowing for a reduction in the thickness of the board unit and memory system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional connection structures are used to maintain reliable electrical connections, then connection reliability is improved, but device thickness increases
Solution Approach 1:
The patent transitions from conventional planar connections to three-dimensional connections by routing extension portions through holes in the board. This vertical dimension utilization allows connections to be established without increasing the horizontal footprint, enabling thinner device design while maintaining connection reliability through proper soldering or conductive bonding within the holes.
Solution Approach 2:
The extension portions of terminals are nested within the holes of the board structure, with electroconductive materials filling the space between them. This nesting approach allows the connection structure to be compactly integrated within the existing board thickness, avoiding additional external thickness while ensuring reliable electrical connection.
2Length of stationary object
If board thickness is reduced to achieve compact design, then device compactness is improved, but connection stability deteriorates
Solution Approach 1:
The patent applies different structural qualities to different regions: the board maintains thin overall thickness, while the connection regions (holes with electroconductive materials) provide localized structural reinforcement and stable electrical pathways. This local quality differentiation allows compact design while ensuring connection stability at critical points.
Solution Approach 2:
The connection structure combines multiple materials with complementary properties: the board material provides mechanical support, extension portions provide electrical conductivity, and electroconductive materials (solder or paste) provide both electrical connection and mechanical bonding. This composite approach ensures stable connections even in thin board designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a thinner memory system and electronic device design by securing reliable electrical connections between the board and components, thereby reducing the overall thickness and enhancing the compactness of the device.
Implementation Method 1
The connection portion has electroconductivity. The connection portion is between the first electroconductive portion and the extension portion
Data Source
AI summary
A board unit of an embodiment includes a board, an electronic component, and a connection portion. The electronic component is on the board. The connection portion connects the board and the electronic component. The board includes a first surface, a hole, and a first electroconductive portion. The first surface faces the electronic component. The hole is on the first surface. The first electroconductive portion is on at least one of the first surface and an inner surface of the hole. The electronic component has a first terminal. The first terminal has an extension portion. The extension portion extends in a second direction intersecting a first direction. The second direction is a thickness direction of the board. The extension portion has at least a part inserted into the hole. The connection portion has electroconductivity. The connection portion is between the first electroconductive portion and the extension portion.