Printed Board Warping Detection and Measurement Position Setting
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Solution Overview
Problem
Existing electronic component mounting apparatuses face difficulties in efficiently setting measurement positions on warped printed boards, leading to complications in height measurement and accurate component mounting due to the need for multiple position settings and complex coordinate input.
Innovation Solution
A method and apparatus that measure the warping state of a printed board using a height level detection device, display the warping state graphically, allow for easy setting of measurement positions on a monitor, convert these positions into coordinates, and store them for efficient mounting operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple measurement positions are set on a printed board to account for warping state, then measurement precision is improved, but device complexity and operation complexity increase
Solution Approach 1:
The system automatically determines measurement positions based on board warping detection, eliminating the need for manual coordinate input. The height level detection device self-adapts to the board's warping state and selects appropriate measurement positions autonomously, resolving the contradiction between measurement precision and operation complexity.
Solution Approach 2:
The system dynamically adjusts measurement parameters (positions, coordinates) based on the detected warping state of the printed board. By changing the measurement parameters according to the actual board condition rather than using fixed positions, the system achieves high measurement precision without requiring complex pre-setting of multiple positions.
2Measurement precision
If multiple measurement positions are set on a printed board, then measurement precision is improved, but loss of time increases
Solution Approach 1:
The system performs preliminary warping detection of the printed board before component mounting, using the height level detection device to identify the warping state in advance. This preliminary action allows the system to pre-determine the necessary measurement positions and coordinates, eliminating the time-consuming manual setting process while ensuring measurement precision is maintained.
Solution Approach 2:
The system automatically determines measurement positions based on board warping detection, eliminating the need for manual coordinate input. The height level detection device self-adapts to the board's warping state and selects appropriate measurement positions autonomously, resolving the contradiction between measurement precision and operation complexity.
3Adaptability or versatility
If manual coordinate input is required for measurement positions, then adaptability to different board warping states is improved, but ease of operation deteriorates
Solution Approach 1:
The system automatically determines measurement positions based on board warping detection, eliminating the need for manual coordinate input. The height level detection device self-adapts to the board's warping state and selects appropriate measurement positions autonomously, resolving the contradiction between measurement precision and operation complexity.
Solution Approach 2:
The system replaces manual mechanical coordinate input with an automated optical detection system. The height level detection device uses optical methods to detect board warping and automatically calculates measurement positions, substituting the manual mechanical process with an automated system that maintains adaptability while improving ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the setting of measurement positions, reduces the number of measurement points, and minimizes the time required for height level detection, ensuring accurate and efficient electronic component mounting on warped boards by adjusting the suction nozzle positioning accordingly.
Implementation Method 1
a height level detection device measures a height level of a positioned printed board
Implementation Method 2
an electronic component is picked up from a component feeding device by suction by a suction nozzle
Data Source
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AI summary
The invention realizes setting of measurement positions suitable for a warping state of a printed board and an easy work of setting the measurement positions. A printed board as a measurement sample is positioned three-dimensionally in X, Y and vertical directions on a positioning portion, and then a backup base is lifted up to apply backup pins to the back surface of the board and support the board horizontally. Then, the warping state of the board is measured by a height level detection device (18), and based on the measurement result the CPU (30) displays the board on a monitor (34) three-dimensionally or by contour lines. Once an operator sets measurement positions on the screen (34), the CPU (30) converts each of the set positions into coordinates on the board, writes the coordinates of the set positions in the top of mounting data, and stores the data in the RAM (32). Then, in a manufacturing operation with a board, the height level detection device (18) measures the height levels of the board in the set measurement positions according to the mounting data where the coordinates of the set positions are added and stores the measurement values in the RAM (32). The measurement values are used when electronic components are mounted on the board.