Boardless LED Assembly with Molded Conductive Circuit
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Solution Overview
Problem
Electrical circuit boards constrain device design with their planar configuration and require separate housings, limiting flexibility in shape and functionality, especially in applications like vehicle interiors where non-planar shapes are beneficial.
Innovation Solution
The development of an electrical device that integrates electrical components directly onto a conductive circuit without a circuit board, using a conductive material formed into various shapes and encapsulated with thermoplastic polymer, allowing for both electrical and thermal connections while forming a part of the device's housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electrical circuit boards are used to interconnect electrical components, then electrical connectivity and structural support are provided, but the device is constrained to planar configurations and requires separate housings, limiting design flexibility
Solution Approach 1:
The patent combines the circuit board, housing, and electrical components into a single integrated structure. The molded housing directly incorporates circuit board support features and mounting locations, eliminating the need for separate components. This merging of functions resolves the contradiction by providing design flexibility while reducing overall device complexity through integration.
Solution Approach 2:
The molded housing serves multiple functions simultaneously: it provides structural support, electrical insulation, mechanical protection, and circuit board mounting. This multi-functionality allows the single component to replace what would traditionally require multiple separate parts, thereby improving adaptability without increasing device complexity.
2Temperature
If traditional circuit boards with separate housings are used, then electrical components are protected and organized, but thermal management efficiency is reduced and waterproofing requires additional sealing mechanisms
Solution Approach 1:
The patent integrates thermal management features directly into the molded housing structure. Heat sinks, thermal pathways, and ventilation channels are formed as integral parts of the housing during molding, eliminating the need for separate thermal management components and improving thermal efficiency through direct contact and optimized heat flow paths.
Solution Approach 2:
The molded housing incorporates integrated sealing features such as grommets, lips, and recesses that provide waterproofing without requiring additional sealing mechanisms. The flexible nature of the molded material allows for effective seals at component interfaces while maintaining structural integrity.
3Shape
If electrical components are mounted on separate circuit boards, then assembly and manufacturing are standardized, but the device lacks complex shapes and requires multiple assembly steps
Solution Approach 1:
The patent incorporates circuit board mounting features, alignment pins, and component locations directly into the molded housing during the molding process. This preliminary action of pre-integrating mounting features eliminates the need for separate assembly steps to attach circuit boards and housings, thereby enabling complex shapes while maintaining productivity.
Solution Approach 2:
By combining the housing and circuit board support into a single molded part, the patent enables complex three-dimensional shapes that would be difficult to achieve with separate planar circuit boards. The integration allows the circuit board to conform to the complex housing geometry while reducing the number of assembly operations required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of devices with complex shapes and enhanced durability, eliminating the need for separate housings and circuit boards, providing improved thermal management and waterproofing, while allowing for a wide range of configurations and applications.
Implementation Method 1
Molten plastic is then injected around the electrical components to thereby at least partially encapsulate the components and physically interconnect them to the previously-formed part
Implementation Method 2
Thermoplastic polymer material is molded around the electrical component while it is in the first mold cavity to thereby encapsulate the electrical component in a protective capsule of polymer material
Implementation Method 3
an electrically conductive circuit that is embedded in polymer material. The electrical circuit includes interconnected conductive elements
Implementation Method 4
providing improved thermal management
Data Source
AI summary
An electrical device such as an LED light assembly includes a conductive circuit and one or more electrical components connected to the circuit. The electrical components and the circuit are at least partially overmolded with a thermoplastic polymer material to encapsulate the components. The material utilized to cover the circuit and/or electrical components may also be utilized to form a housing or other structure of a finished part.