Bobbin Shielding Wall for EMI Miniaturization
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Solution Overview
Problem
Existing electronic device modules face challenges in miniaturization and electromagnetic interference shielding, particularly in high-frequency applications, where conventional shielding structures are inefficient and increase module size.
Innovation Solution
An electronic device module design featuring a substrate with a shielding wall comprising a bobbin and conductive portion, where the bobbin is made of a different material than the sealing portions, and a shielding layer is formed along the sealing and shielding wall surfaces to block electromagnetic waves, connected to a ground layer for enhanced shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional shielding structures are used in high-frequency electronic device modules, then electromagnetic wave shielding is provided, but the module size increases and miniaturization is hindered
Solution Approach 1:
The shielding wall is formed by winding a conductive wire around a bobbin, creating a nested structure where the conductive wire is wrapped around the bobbin body. This nesting approach allows the shielding function to be achieved within a compact volume, effectively providing electromagnetic wave shielding without increasing module size.
Solution Approach 2:
The shielding structure transitions from a planar or bulk form to a three-dimensional wound configuration around the bobbin. By utilizing the radial dimension of the bobbin, the shielding wall achieves effective electromagnetic interference protection while maintaining a compact footprint, resolving the contradiction between shielding effectiveness and miniaturization.
2Object-affected harmful factors
If shielding structures are added to protect components from electromagnetic interference, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The bobbin serves multiple functions: it provides the structural core around which the conductive wire is wound to create the shielding wall, and it also acts as a support element for mounting components. This multi-functionality reduces the need for separate structural and shielding components, thereby reducing device complexity while maintaining shielding effectiveness.
Solution Approach 2:
The shielding wall is formed as a composite structure combining the bobbin (providing mechanical support and geometric form) and the conductive wire (providing electromagnetic shielding). This composite approach achieves effective EMI protection through the synergistic combination of different materials, simplifying the overall shielding structure compared to using solid conductive materials.
3Ease of manufacture
If a bobbin with smaller width than height is used, then manufacturing cost is reduced and thermal expansion damage is minimized, but the shielding wall structure becomes more complex
Solution Approach 1:
The bobbin is designed with asymmetric dimensions where the width is smaller than the height, optimizing the structure for both manufacturing efficiency and thermal expansion management. This asymmetric geometry allows the conductive wire to be wound in a pattern that effectively shields against electromagnetic interference while accommodating differential thermal expansion between components, reducing the risk of thermal damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the overall size of the module while providing robust electromagnetic interference shielding, reducing manufacturing costs and minimizing thermal expansion-related damage through the use of a bobbin with a smaller width than height and conductive wires wound on its surface.
Implementation Method 1
a shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall
Data Source
AI summary
An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a second component disposed on the first surface of the substrate, a first sealing portion to seal the first component, a second sealing portion to seal the second component, a shielding wall disposed between the first component and the second component. The shielding wall includes a bobbin disposed between the first sealing portion and the second sealing portion and a conductive portion to seal the bobbin. A shielding layer of a conductive material is disposed along a surface formed by the first sealing portion, the second sealing portion, and the shielding wall.