Boiler-Targeted Gas Cooling Module for Immersion Electronics Testing
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Solution Overview
Problem
Existing two-phase immersion cooling systems face challenges in production and testing due to the need to frequently move electronic devices in and out of liquid cooling tanks for debugging, leading to prolonged testing times and potential component damage when transitioning to air environments, which have lower thermal conductivity and can cause overheating.
Innovation Solution
A gas cooling module with a gas supply source and fluid guide member is used to eject cooling gas directly onto the boiler of an immersion electronic apparatus, allowing direct testing in an air environment without replacing the boiler with a heat sink, and includes features like phase change media and vortex tubes for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic devices are frequently moved in and out of liquid cooling tanks for debugging and troubleshooting, then device stability can be improved, but production testing time is prolonged
Solution Approach 1:
The gas cooling module is designed to be universally applicable to immersion electronic apparatus, enabling the same device to be tested in both liquid cooling and air cooling environments without modification. This multi-functionality allows debugging to be performed in air environment while maintaining cooling effectiveness, eliminating the need for frequent tank transfers and reducing testing time.
2Productivity
If electronic devices are tested in air environment without appropriate cooling measures, then testing efficiency can be improved, but device overheating and damage may occur
Solution Approach 1:
The gas cooling module utilizes pneumatic principles by supplying cooling gas through a fluid guide member that ejects the gas toward the boiler. This pneumatic cooling system enables effective heat dissipation in air environment, allowing continuous testing without device overheating while maintaining high testing efficiency.
Solution Approach 2:
The cooling system utilizes phase change media that undergo phase transitions to absorb and dissipate heat from the electronic device. This phase change mechanism provides efficient cooling in air environment, ensuring device safety during continuous testing operations.
3Adaptability or versatility
If the boiler is replaced with a conventional heat sink for air cooling testing, then device operation in air environment is enabled, but time-consuming and labor-intensive operations increase
Solution Approach 1:
The gas cooling module maintains the original boiler component while adding gas cooling capability, making the system universal for both liquid and air cooling operations. This approach preserves the immersion cooling device's original structure and enables air cooling testing without replacing the boiler, significantly reducing assembly complexity and operation time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The gas cooling module effectively maintains device temperature below 100°C during high-power operation, reducing production and verification cycles, minimizing component damage, and enhancing testing efficiency.
Implementation Method 1
the fluid guide member ejects the cooling gas toward the boiler
Implementation Method 2
the boiler is disposed on a heat source of the circuit board
Implementation Method 3
includes features like phase change media and vortex tubes for enhanced heat dissipation
Implementation Method 4
includes features like phase change media and vortex tubes for enhanced heat dissipation
Data Source
AI summary
A gas cooling module for an immersion electronic apparatus and a test device equipped with the gas cooling module are provided. The immersion electronic apparatus includes a boiler disposed on a heat source of a circuit board. The gas cooling module includes a gas supply source and a fluid guide member. Cooling gas is introduced from the gas supply source into the fluid guide member, and is ejected toward the boiler, so that heat can be effectively taken away, and the immersion electronic apparatus can be tested in an air environment. The test device further integrates a housing, the immersion electronic apparatus is placed in the housing, and the test device is equipped with the foregoing gas cooling module, to perform a more comprehensive performance test.