Boiling Thermal Chamber Structure for High-Density Electronics Cooling
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Solution Overview
Problem
Existing thermal management methods in electronic devices face challenges in managing high heat density and maintaining uniform temperature distribution, particularly due to issues like dry-out and inefficient heat transfer during boiling and evaporation processes.
Innovation Solution
A thermal management structure utilizing a thermal management chamber with hydrophilic and hydrophobic surfaces and third walls to enhance boiling-based heat transfer, improving thermal resistance and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal management chamber uses evaporation-based thermal management at room temperature with a wick structure, then the device can operate at room temperature, but the structure becomes more complex and dry-out occurs considerably
Solution Approach 1:
The patent employs boiling (phase transition from liquid to vapor) instead of evaporation to achieve thermal management. The working fluid undergoes phase change at the boiling point, enabling efficient heat transfer without requiring complex wick structures. This resolves the contradiction by using a simpler boiling mechanism rather than a more complex evaporation-based wick system.
Solution Approach 2:
The patent removes the wick structure entirely from the thermal management system. By using boiling-based heat transfer, the system eliminates the need for capillary wick structures that were necessary in evaporation-based systems. This extraction of the wick component simplifies the overall device structure while maintaining effective thermal management.
2Loss of energy
If a thermal management chamber uses evaporation-based thermal management, then heat dissipation can occur, but the liquid temperature decreases during evaporation and dry-out occurs considerably
Solution Approach 1:
The patent uses boiling (phase transition at constant temperature) instead of evaporation (temperature-dependent process). During boiling, the working fluid maintains a constant temperature at the boiling point while absorbing heat, preventing temperature decrease. This resolves the contradiction by using a phase transition process that maintains temperature stability while achieving effective heat dissipation.
3Volume of moving object
If electronic devices are downsized and thinner with high integration, then device miniaturization is achieved, but heat density increases requiring better thermal management
Solution Approach 1:
The patent employs boiling-based thermal management that leverages phase transition for high-efficiency heat transfer. This enables effective heat dissipation from compact high-density components without increasing device size. The boiling mechanism provides superior heat transfer coefficients compared to conventional conduction methods, allowing high heat density management in miniaturized devices.
Solution Approach 2:
The patent changes the thermal management approach from passive conduction to active phase-change-based heat transfer. By utilizing boiling, the system achieves dramatically improved heat transfer efficiency, enabling high-power-density devices to be miniaturized without proportionally increasing thermal management requirements.
4Loss of energy
If a thermal management chamber uses boiling-based thermal management, then heat dissipation efficiency improves and structure simplifies, but the system must operate at boiling point temperature
Solution Approach 1:
The patent changes the operating temperature parameter to the boiling point of the working fluid to enable phase-change-based heat transfer. This temperature adjustment allows the system to achieve superior heat dissipation efficiency through boiling, resolving the contradiction between heat transfer performance and operating temperature requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat and maintains uniform temperature distribution, enhancing thermal performance and manufacturability of electronic devices with higher heat and power consumption.
Implementation Method 1
The thermal management chamber may be configured to generate bubbles in the working fluid at or above a critical boiling temperature of the working fluid
Implementation Method 2
A boiling-based heat transfer may include natural convection, a phase change occurring by transient heat conduction of a heated surface of a liquid
Implementation Method 3
a first wall disposed adjacent to the heat source and having a hydrophilic first surface
Implementation Method 4
a second wall disposed opposite the first wall spaced apart from the heat source and having a hydrophobic second surface
Implementation Method 5
a heat diffusion device that operates at room temperature using the capillarity and evaporation principles
Implementation Method 6
the boiling-based thermal management method may operate at a boiling point and use latent heat and convection
Data Source
AI summary
An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display disposed on the housing on the opposite side from the heat source. The thermal management chamber includes a working fluid, and is configured to generate bubbles in the working fluid at or above the boiling critical temperature of the working fluid. The thermal management chamber may include: a first wall located adjacent to the heat source and having a first hydrophilic surface; a second wall located on the opposite side from the first wall and spaced apart from the heat source, and having a second hydrophobic surface, and a plurality of third walls located between the first wall and the second wall.