Bolometer THz Detector Air Gap Reduction

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Solution Overview

Problem

Conventional bolometer-type THz wave detectors experience a reduction in manufacturing yield due to cracks in the temperature detecting portion, which occur as a result of thermal expansion coefficient differences between the sacrificial layer and other materials, especially when the air gap is increased during the manufacturing process.

Innovation Solution

A bolometer-type THz wave detector with a thermal isolation structure where the temperature detecting portion is supported by a dielectric film, reducing the air gap to less than 8 μm, forming an optical resonant structure that enhances THz wave absorption and minimizes crack occurrence.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the air gap is increased to improve THz wave absorption efficiency, then the absorption efficiency is improved, but cracks occur in the temperature detecting portion due to thermal expansion coefficient differences, reducing manufacturing yield

Engineering Contradiction:
Improveabsorption efficiencyVSAvoidmanufacturing yield
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent changes the physical parameter of the air gap from 8-14 μm to less than 8 μm, fundamentally altering the structural configuration to eliminate thermal expansion stress while preserving detection functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The dielectric film serves as an intermediary component between the temperature detecting portion and the substrate, providing both mechanical support and thermal isolation while enabling THz wave transmission

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the air gap is reduced to less than 8 μm to prevent cracks and improve manufacturing yield, then manufacturing yield is improved, but THz wave absorption efficiency may be compromised

Engineering Contradiction:
Improvemanufacturing yieldVSAvoidabsorption efficiency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The dielectric film acts as a mediator that enables the small air gap structure to function effectively by providing thermal isolation and mechanical support while maintaining THz wave transmission capability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent optimizes the dielectric film thickness parameter to achieve the right balance between mechanical support, thermal isolation, and THz wave transmission, enabling efficient absorption despite the reduced air gap

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The reduced air gap structure improves the manufacturing yield and absorption efficiency of THz waves, reducing the frequency of defective pixels and maintaining high sensitivity.

Implementation Method 1

when taking account of the absorbing structure using optical interference

Methodology Applied
Scientific EffectOptical interference: Interference

Implementation Method 2

an optical resonant structure formed by the reflective film and the temperature detecting portion

Methodology Applied
Scientific EffectOptical resonance: Resonance

Implementation Method 3

a bolometer-type THz wave detector having a thermal isolation structure

Methodology Applied
Scientific EffectThermal isolation: Thermal Insulation

Implementation Method 4

a temperature detecting portion (diaphragm) 14 composed of the second protecting film 6, a bolometer thin film 7

Methodology Applied
Scientific EffectBolometer effect: Bolometer

Data Source

PatentUS8541742B2Bolometer-type THz wave detector
Publication Date: 2013.09.24 NEC CORP
  • US8541742B2 patent drawing
  • US8541742B2 patent drawing
  • US8541742B2 patent drawing

AI summary

The bolometer-type THz wave detector according to the present invention has a thermal isolation structure in which a temperature detecting portion including a bolometer thin film connected to electrical wirings is supported in a state of being raised from the substrate by a supporting portion including the electrical wirings connected to a Read-out integrated circuit formed in a substrate, and the detector comprises a reflective film formed on the substrate, an absorbing film formed on the front surface or back surface or at an inner position in the temperature detecting portion , whereby an optical resonant structure is formed by the reflective film and the absorbing film, and a dielectric film formed on the reflective film. The dielectric film thickness f is set so that air gap between an upper surface of the dielectric film and a lower surface of the temperature detecting portion is smaller than 8 μm.