Bond Arm Alignment via Rotary Tilt Detection
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Solution Overview
Problem
The existing manual method for adjusting bond arm tilt in flip chip bonding is time-consuming and prone to human errors, leading to uneven solder bump flatness and increased risk of cold joints due to the qualitative and repetitive nature of mechanical adjustments.
Innovation Solution
A method and system for automatically aligning the bond arm by rotating it around a longitudinal axis through a bond head, pausing at predefined angular positions to determine and select the optimal tilt angle that satisfies a predefined specification, ensuring the bond arm is substantially perpendicular to the bonding support surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment method is used to control bond arm tilt, then the bond arm can be adjusted to different orientations, but the process is time-consuming and prone to human errors
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated measurement and control system. A measurement device detects the bond arm tilt angle, and a control device automatically adjusts the bond arm orientation based on the detected angle and target specifications, eliminating manual intervention and significantly reducing alignment time.
Solution Approach 2:
The system enables self-alignment of the bond arm through automated feedback control. The measurement device continuously monitors the tilt angle, and the control device autonomously makes adjustments without human intervention, allowing the system to self-correct and achieve precise alignment automatically.
2Manufacturing precision
If repeated mechanical adjustments are performed to achieve acceptable bond arm tilt, then the alignment precision can be improved, but the process becomes more complex and error-prone
Solution Approach 1:
The patent replaces complex repeated mechanical adjustments with an automated measurement and control system. The measurement device provides precise tilt angle detection, and the control device automatically calculates and executes the required adjustments, achieving high precision while simplifying the overall process and eliminating human error.
Solution Approach 2:
The system implements closed-loop feedback control where the measurement device continuously monitors the bond arm tilt angle and provides feedback to the control device. The control device compares the detected angle with the target specification and automatically adjusts the bond arm until the desired precision is achieved, eliminating the need for repeated manual trial-and-error adjustments.
3Measurement precision
If manual measurement and assessment is used to evaluate bond arm tilt, then the alignment can be verified, but human errors such as misreading measurements may occur
Solution Approach 1:
The patent replaces manual measurement and reading with an automated measurement device that electronically detects and reports the tilt angle. The control device automatically processes the measurement data, eliminating human reading errors and significantly improving both measurement precision and reliability through electronic detection and automated data processing.
Data Source
AI summary
A method, as well as a system implementing the method, for automatically aligning a bond arm with respect to a bonding support surface for supporting a substrate during a bonding process. The method comprises: rotating the bond arm for a first revolution around a longitudinal axis through a bond head moveably coupled to the bond arm, the first revolution including a plurality of predefined rotary angular positions; pausing the rotation of the bond arm at each of the plurality of rotary angular positions; determining a tilt angle of the bond arm relative to the bonding support surface during each pause at the respective rotary angular position; and selecting the rotary angular position of the bond arm which has a tilt angle that satisfies a predefined specification such that the bond arm is aligned substantially perpendicular to the bonding support surface.