Interconnected Bond Fingers for IC Supply Voltage Inductance Reduction
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Solution Overview
Problem
Integrated circuit device performance is limited by signal integrity issues, particularly due to switching noise caused by simultaneous switching of output driver circuits, which is exacerbated by high operating clock frequencies and increased inductance in supply voltage or ground nets.
Innovation Solution
The solution involves electrically interconnecting multiple supply voltage or ground bond fingers to reduce inductance in these nets, thereby decreasing switching noise and allowing for higher operating clock frequencies without increasing manufacturing costs by adding extra layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple supply voltage or ground bond fingers are electrically interconnected, then inductance in supply voltage or ground nets is reduced and signal integrity is improved, but device complexity increases
Solution Approach 1:
Multiple supply voltage bond fingers or ground bond fingers are electrically interconnected through conductive structures (such as conductive paste, metal layers, or vias) to form a combined low-inductance connection. This merging of multiple bond fingers reduces the overall inductance of the power and ground nets, thereby improving signal integrity and reducing switching noise without requiring additional external components.
Solution Approach 2:
The electrical interconnection of bond fingers is achieved by utilizing additional spatial dimensions within the device package, such as incorporating conductive layers in intermediate substrates or using vertical vias to connect bond fingers at different locations. This approach reduces inductance by creating multiple parallel current paths through three-dimensional space rather than relying solely on planar connections.
2Productivity
If operating clock frequency is increased, then integrated circuit device performance is improved, but switching noise increases and signal integrity deteriorates
Solution Approach 1:
The inductance parameter of the power and ground nets is changed by electrically interconnecting multiple bond fingers, which reduces the overall inductance value. This parameter change allows the system to operate at higher clock frequencies because the reduced inductance minimizes the voltage noise generated during simultaneous switching events, thereby maintaining signal integrity at higher operating speeds.
3Object-affected harmful factors
If inductance in supply voltage or ground nets is reduced, then switching noise is decreased and signal integrity is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive structures used to interconnect bond fingers serve multiple functions: they provide electrical connection between bond fingers, act as power or ground distribution paths, and function as noise reduction elements by reducing inductance. This multi-functionality eliminates the need for separate components or structures dedicated solely to noise reduction, thereby simplifying the overall manufacturing process while achieving the desired reduction in switching noise.
Data Source
AI summary
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond fingers may be connected together via one or more electrically conductive interconnects.